Handling of Different FOPLP Layouts on Large Area Thermal Chucks

This paper intends to provide insight into the complexities of processing large panel format for Fan-out. It explicitly tackles handling and thermal treatment during the thermal debonding process, which is the method of separating the molded Fan-out panel from the metal plate carrier bonded by a thermal sensitive double-sided tape. Fan-out encounters two prevalent issues inherent to the structure of the package; die-shift and warpage. Both will be covered and have been taken into account in defining the correct process flow and control of panel-level thermal debonding. The handling mechanism of the panel will play a significant role in eliminating potential handling-induced factors. Thermal control, on the other hand, is essential to control die shift caused by any thermal introduction. This paper details how mechanical design, handling, and thermal control come into play to ensure that common issues for a Fan-out structure are also addressed in panel-level form. Different panel matrix layout is examined to identify how it reacts with the optimized process flow.