紧凑的物理ir下降模型的GSI配电网络

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) Pub Date : 2003-06-02 DOI:10.1109/IITC.2003.1219711

K. Shakeri, J. Meindl

{"title":"紧凑的物理ir下降模型的GSI配电网络","authors":"K. Shakeri, J. Meindl","doi":"10.1109/IITC.2003.1219711","DOIUrl":null,"url":null,"abstract":"The supply voltage decrease and power density increase of future GSI chips demands accurate models for the IR-drop voltage. Compact physical IR-drop models are derived for two types of packages. These models help designers estimate the required amount of interconnects and package pins which need to be dedicated for power distribution. Comparison with SPICE simulations show less than 1% and 5% error for the wire-bond package and the area-array package, respectively.","PeriodicalId":212619,"journal":{"name":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Compact physical IR-drop models for GSI power distribution networks\",\"authors\":\"K. Shakeri, J. Meindl\",\"doi\":\"10.1109/IITC.2003.1219711\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The supply voltage decrease and power density increase of future GSI chips demands accurate models for the IR-drop voltage. Compact physical IR-drop models are derived for two types of packages. These models help designers estimate the required amount of interconnects and package pins which need to be dedicated for power distribution. Comparison with SPICE simulations show less than 1% and 5% error for the wire-bond package and the area-array package, respectively.\",\"PeriodicalId\":212619,\"journal\":{\"name\":\"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2003.1219711\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2003.1219711","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 12

摘要

未来GSI芯片电源电压的降低和功率密度的增加要求精确的ir降压模型。紧凑的物理IR-drop模型推导了两种类型的包装。这些模型帮助设计人员估计需要专用于配电的互连和封装引脚的数量。与SPICE仿真结果相比，线键封装和面阵封装的误差分别小于1%和5%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Compact physical IR-drop models for GSI power distribution networks

The supply voltage decrease and power density increase of future GSI chips demands accurate models for the IR-drop voltage. Compact physical IR-drop models are derived for two types of packages. These models help designers estimate the required amount of interconnects and package pins which need to be dedicated for power distribution. Comparison with SPICE simulations show less than 1% and 5% error for the wire-bond package and the area-array package, respectively.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)

自引率

0.00%

发文量