C. Minassian, J. Tissot, M. Vilain, O. Legras, S. Tinnes, B. Fièque, J. Chiappa, P. Robert
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引用次数: 39
摘要
ULIS和CEA/LETI在非晶硅层非冷却微辐射热计方面积累的高水平专业知识使ULIS能够开发出384 x 288 (1/4 VGA) 25 μm像素间距的IRFPA格式,专为低端应用而设计。该探测器保持了在全电视格式ROIC(探测器配置串行链路,低功耗或宽电动态范围…)上开发的所有创新。该装置的特殊吸引力在于TEC-less(热电冷却器)封装的小型化及其极轻的重量。像素间距的降低和创新的封装使该阵列成为一种低成本的产品,非常适合大规模生产。我们将首先介绍已经开发的简单的无tec操作模式。电光特性随环境温度的变化将被呈现。
Uncooled amorphous silicon TEC-less 1/4 VGA IRFPA with 25 μm pixel-pitch for high volume applications
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 x 288 (1/4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application. This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range ...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production. We will present first the simple TEC-less operating mode which has been developed. The electro-optical characterization versus environmental temperature will be presented.