CMOS集成芯片实现毫米波和太赫兹波段的主动和被动可重构智能表面

S. Venkatesh, H. Saeidi, K. Sengupta, Xuyang Lu
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引用次数: 0

摘要

尽管5G毫米波(mmWave)网络的初始部署已经展示了多gb /s的无线链路,但由于其定向波束的性质,它们通常非常容易受到阻塞、信道中断和衰落的影响。为了克服这一主要障碍,下一代通信系统必须具有弹性,包括安全性、适应性和自主性。可重构智能表面(RISs)已成为解决这些挑战的潜在候选,并具有动态重新配置无线电传播信道的能力。在这篇特约文章中,我们介绍了两种通过CMOS IC实现的可重构智能电磁表面设计,即a)毫米波57-64 GHz有源可重构反射器阵列b)通过CMOS IC平铺方法实现的太赫兹动态可编程被动全息超表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Active and Passive Reconfigurable Intelligent Surfaces at mm-Wave and THz bands enabled by CMOS Integrated Chips
Though the initial deployment of 5G millimeter-Wave (mmWave) networks has demonstrated multi-Gb/s wireless links, they are often highly susceptible to blockages, channel disruptions, and fading due to the nature of their directive beams. To overcome this major impediment, the next generation of communication systems will have to be resilient, which encompasses security, adaptability, and autonomy. Reconfigurable Intelligent Surfaces (RISs) have emerged as a potential candidate to address these challenges and have the capability to dynamically reconfigure the radio propagation channels on-the-fly. In this invited article, we present two reconfigurable intelligent electromagnetic surface designs enabled through CMOS ICs namely, a) mm-Wave 57–64 GHz active reconfigurable reflector array b) THz dynamically programmable passive holographic metasurface enabled through CMOS IC tiling approach.
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