{"title":"/spl μ /透明绝缘通道作为小型化学分离装置的元件","authors":"R. Schasfoort, J. Hendrikse, A. van den Berg","doi":"10.1109/imnc.2000.872604","DOIUrl":null,"url":null,"abstract":"Currently, miniaturized devices that apply electro osmotic pumping or electrophoretic separations are mostly constructed by etching small insulating channels for supply and separation on glass substrates. In principle, silicon is a superior construction material in terms of inertness and design flexibility. However, because of its semiconducting properties, the use in high voltage applications like the ones mentioned above is quite limited. In this paper, the use of /spl mu/Transparent Insulating Channel (/spl mu/TIC) technology is demonstrated as a standard procedure to manufacture miniaturized analytical separation devices. This technique, /spl mu/channels having extremely thin, transparent and insulating walls can be fabricated. An overview of the impact of this technology is given, showing the advantages of a fabrication technology that is as flexible as silicon technology for the fabrication of /spl mu/TAS or \"lab on a chip\" devices. The following basic technology and control parameters will be highlighted. 1. Up to 100 /spl mu/m wide rectangular channels 2. Bosses and leak-free connections to external /spl mu/ fluidics. 3. Web-like structures for inlets/outlets>100 /spl mu/m. 4. Implementation of conductivity electrodes 5. Good thermal dissipation properties of the thin walls 6. Control of the electro osmotic flow by a radial voltage.","PeriodicalId":270640,"journal":{"name":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"/spl mu/transparent insulating channels as components for miniaturized chemical separation devices\",\"authors\":\"R. Schasfoort, J. Hendrikse, A. van den Berg\",\"doi\":\"10.1109/imnc.2000.872604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Currently, miniaturized devices that apply electro osmotic pumping or electrophoretic separations are mostly constructed by etching small insulating channels for supply and separation on glass substrates. In principle, silicon is a superior construction material in terms of inertness and design flexibility. However, because of its semiconducting properties, the use in high voltage applications like the ones mentioned above is quite limited. In this paper, the use of /spl mu/Transparent Insulating Channel (/spl mu/TIC) technology is demonstrated as a standard procedure to manufacture miniaturized analytical separation devices. This technique, /spl mu/channels having extremely thin, transparent and insulating walls can be fabricated. An overview of the impact of this technology is given, showing the advantages of a fabrication technology that is as flexible as silicon technology for the fabrication of /spl mu/TAS or \\\"lab on a chip\\\" devices. The following basic technology and control parameters will be highlighted. 1. Up to 100 /spl mu/m wide rectangular channels 2. Bosses and leak-free connections to external /spl mu/ fluidics. 3. Web-like structures for inlets/outlets>100 /spl mu/m. 4. Implementation of conductivity electrodes 5. Good thermal dissipation properties of the thin walls 6. Control of the electro osmotic flow by a radial voltage.\",\"PeriodicalId\":270640,\"journal\":{\"name\":\"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/imnc.2000.872604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/imnc.2000.872604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
/spl mu/transparent insulating channels as components for miniaturized chemical separation devices
Currently, miniaturized devices that apply electro osmotic pumping or electrophoretic separations are mostly constructed by etching small insulating channels for supply and separation on glass substrates. In principle, silicon is a superior construction material in terms of inertness and design flexibility. However, because of its semiconducting properties, the use in high voltage applications like the ones mentioned above is quite limited. In this paper, the use of /spl mu/Transparent Insulating Channel (/spl mu/TIC) technology is demonstrated as a standard procedure to manufacture miniaturized analytical separation devices. This technique, /spl mu/channels having extremely thin, transparent and insulating walls can be fabricated. An overview of the impact of this technology is given, showing the advantages of a fabrication technology that is as flexible as silicon technology for the fabrication of /spl mu/TAS or "lab on a chip" devices. The following basic technology and control parameters will be highlighted. 1. Up to 100 /spl mu/m wide rectangular channels 2. Bosses and leak-free connections to external /spl mu/ fluidics. 3. Web-like structures for inlets/outlets>100 /spl mu/m. 4. Implementation of conductivity electrodes 5. Good thermal dissipation properties of the thin walls 6. Control of the electro osmotic flow by a radial voltage.