{"title":"用于倒装芯片封装功率放大器的CPW MMIC功率放大器设计","authors":"A. Wong, K. McAdoo, D. Linton","doi":"10.1109/HFPSC.2000.874078","DOIUrl":null,"url":null,"abstract":"There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization.","PeriodicalId":185234,"journal":{"name":"2000 High Frequency Postgraduate Student Colloquium (Cat. No.00TH8539)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"CPW MMIC power amplifier design for flip-chip packaged power amplifiers\",\"authors\":\"A. Wong, K. McAdoo, D. Linton\",\"doi\":\"10.1109/HFPSC.2000.874078\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization.\",\"PeriodicalId\":185234,\"journal\":{\"name\":\"2000 High Frequency Postgraduate Student Colloquium (Cat. No.00TH8539)\",\"volume\":\"54 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 High Frequency Postgraduate Student Colloquium (Cat. No.00TH8539)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HFPSC.2000.874078\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 High Frequency Postgraduate Student Colloquium (Cat. No.00TH8539)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HFPSC.2000.874078","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
CPW MMIC power amplifier design for flip-chip packaged power amplifiers
There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization.
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