用于玻璃陶瓷/铜多层基板的陶瓷绿片技术(ES9000系统)

R. Nufer
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引用次数: 1

摘要

IBM的高端计算机,ES9000系统的820和900型号,使用最先进的基板之一来实现其高最终性能。这些衬底是使用基于特殊开发的陶瓷绿片的多层陶瓷(MLC)工艺制造的。作者讨论了绿色片材的发展,强调了聚合物粘合剂系统的重要性,该系统提供了非常稳定的片材,确保了数百万通孔和内部互连的对齐。综述了绿色薄板粘结剂配方,说明了溶剂在控制薄板微孔隙率方面的作用。介绍了连铸工艺在板材制备、浆料流变学和坯材性能方面的应用
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ceramic greensheet technology for glass-ceramic/copper multilevel substrates (ES9000 system)
IBM's high end computers, models 820 and 900 of the ES9000 systems, use one of the most advanced substrates to achieve their high ultimate performance. These substrates are fabricated using a multilayer ceramic (MLC) process based on a specially developed ceramic green sheet. The author discusses the development of the green sheet, emphasizing the importance of the polymeric binder system that provides a very stable sheet insuring the alignment of millions of vias and internal interconnections. Green sheet binder formulations are reviewed, illustrating the contribution of the solvents in controlling sheet microporosity. The continuous casting process used in sheet preparation, slurry rheology, and green sheet properties is described.<>
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