{"title":"新设计印刷电路板组件的缺陷等级预测","authors":"R. Soukup","doi":"10.1109/ISSE.2009.5207033","DOIUrl":null,"url":null,"abstract":"In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed in Visual Basic for Application (VBA) and can be operated in MS Excel environment.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Defect level prediction for newly designed Printed Circuit Board Assemblies\",\"authors\":\"R. Soukup\",\"doi\":\"10.1109/ISSE.2009.5207033\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed in Visual Basic for Application (VBA) and can be operated in MS Excel environment.\",\"PeriodicalId\":337429,\"journal\":{\"name\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2009.5207033\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 32nd International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2009.5207033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
本文提出了一种新的缺陷水平预测工具，该工具适用于新设计的印刷电路板组件，特别是汽车工业中确定的印刷电路板组件。该工具采用Visual Basic for Application (VBA)编程，可在MS Excel环境下运行。
Defect level prediction for newly designed Printed Circuit Board Assemblies
In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed in Visual Basic for Application (VBA) and can be operated in MS Excel environment.
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