{"title":"基于TCAD器件仿真的高压CMOS双极ESD电源钳","authors":"P. Běťák","doi":"10.1109/ISSE.2009.5206981","DOIUrl":null,"url":null,"abstract":"The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation\",\"authors\":\"P. Běťák\",\"doi\":\"10.1109/ISSE.2009.5206981\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.\",\"PeriodicalId\":337429,\"journal\":{\"name\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2009.5206981\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 32nd International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2009.5206981","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation
The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.