{"title":"一个1V 19.3dBm 79GHz功率放大器在65nm CMOS","authors":"Kun-Yin Wang, Tao-Yao Chang, Chorng-Kuang Wang","doi":"10.1109/ISSCC.2012.6177001","DOIUrl":null,"url":null,"abstract":"For a highly integrated wireless system including on-chip antennas, high-output- power power amplifiers (PA) are required to cover the desired transmission range. In order to achieve the output power level, power-combining techniques have gained more attention in recent years [1-5]. An efficient power-combining solution is essential since less DC power is needed for the same level of output power, and the difficulties of thermo-dissipation are thus relieved in a high-out- put-power PA. Transformer-based power combining is one of the common tech- niques, which can increase impedance-transformation ratio by increasing the number of input ports and results in a compact layout and reasonable loss [1-3, 5].","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"47","resultStr":"{\"title\":\"A 1V 19.3dBm 79GHz power amplifier in 65nm CMOS\",\"authors\":\"Kun-Yin Wang, Tao-Yao Chang, Chorng-Kuang Wang\",\"doi\":\"10.1109/ISSCC.2012.6177001\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For a highly integrated wireless system including on-chip antennas, high-output- power power amplifiers (PA) are required to cover the desired transmission range. In order to achieve the output power level, power-combining techniques have gained more attention in recent years [1-5]. An efficient power-combining solution is essential since less DC power is needed for the same level of output power, and the difficulties of thermo-dissipation are thus relieved in a high-out- put-power PA. Transformer-based power combining is one of the common tech- niques, which can increase impedance-transformation ratio by increasing the number of input ports and results in a compact layout and reasonable loss [1-3, 5].\",\"PeriodicalId\":255282,\"journal\":{\"name\":\"2012 IEEE International Solid-State Circuits Conference\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"47\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2012.6177001\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6177001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
For a highly integrated wireless system including on-chip antennas, high-output- power power amplifiers (PA) are required to cover the desired transmission range. In order to achieve the output power level, power-combining techniques have gained more attention in recent years [1-5]. An efficient power-combining solution is essential since less DC power is needed for the same level of output power, and the difficulties of thermo-dissipation are thus relieved in a high-out- put-power PA. Transformer-based power combining is one of the common tech- niques, which can increase impedance-transformation ratio by increasing the number of input ports and results in a compact layout and reasonable loss [1-3, 5].