毫米波通信和5G的封装天线设计和模块集成

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 1900-01-01 DOI:10.1109/vlsi-dat.2018.8373286

X. Gu, B. Sadhu, Duixian Liu, C. Baks, A. Valdes-Garcia

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引用次数: 0

摘要

RFIC、封装和天线的协同设计和集成对于实现5G无线通信至关重要，在毫米波频率下尤其具有挑战性。本文分别回顾了基站和用户设备应用中毫米波天线模块封装和集成的两个不同方面。我们首先介绍了用于5G基站应用的具有64个双极化天线的28 ghz相控阵模块的挑战、实现和特性。接下来，我们描述了一种紧凑，低功耗，60 ghz的开关波束收发器模块，适用于手机集成，包含4个天线，支持正常和终端发射方向，以实现广泛的链路空间覆盖。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Antenna-in-package design and module integration for millimeter-wave communication and 5G

Co-design and integration of RFIC, package, and antennas are critical to enable 5G wireless communications and is particularly challenging at mmWave frequencies. This paper reviews two different aspects of mmWave antenna module packaging and integration for base station and user equipment applications, respectively. We first present the challenges, implementation, and characterization of a 28GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Next, we describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.

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来源期刊

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

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