采用仿真方法对几种LTCC工艺材料进行HF对比分析

D. Ionescu, V. Cehan
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引用次数: 0

摘要

本文从高频介电性能的角度分析了LTCC技术的玻璃陶瓷产品。在微波范围内,我们考虑了2.4 - 18 GHz的频域,我们的结果即将完成到目前为止在较低频率下得到的结果。利用高频结构模拟器(Ansoft)进行了详细的结构模拟,考虑了每一类材料样品的内部结构。样品的结构特性决定了高频场与材料相互作用的特性。以电有效介电常数值表示的极化水平随频率和温度的变化而变化,与这些相互作用机制一致。在给定的频率范围内,在27 - 200°C的温度域内,电介电常数的参数变化用图形表示,高于层压温度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
HF comparative analysis of some LTCC technology materials by simulation methods
Glass-ceramic products for the LTCC technologies were analyzed in this paper from the point of view of their dielectric properties at high frequencies. A frequency domain of 2.4 – 18 GHz was considered, in microwave range, and our results are coming to complete the results obtained until now at lower frequencies. A detailed structural simulation was performed with help of the High Frequency Structural Simulator (by Ansoft), considering the internal structure of each class of material sample. Samples structural particularities impose the character of the HF field interaction with the material. The polarization level, indicated by the electric effective permittivity value evolves with frequency and temperature in agreement of these interaction mechanisms. The parametrical evolution of the electric permittivity was illustrated on graphs in the specified frequency range and for the temperature domain of 27 – 200 °C, above the lamination temperature.
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