半导体表面闪络特性

Guanjun Zhang, Wenxing Zhao, Zhang Yan
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引用次数: 0

摘要

采用化学蚀刻和未蚀刻两种不同表面处理的硅样品,研究了真空冲击电压下半导体的闪络特性。在闪络前,分别观察了未蚀刻样品的欧姆电流和蚀刻样品的空间电荷限制(SCL)电流。同时,两种样品显示出完全不同的闪络轨迹。所有这些现象都是由于它们的表面态密度和分布不同造成的。提出了一个新的模型来描述沿半导体表面闪络的发展过程,即热效应和随后的电流灯丝随外加电压的变化。结果表明,闪络现象发生在与电极对接的硅的界面层和靠近环境的硅的侧边层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface flashover characteristics of semiconductor
Two kinds of silicon samples with distinct surface treatment, i.e., one surface was chemically etched and the other was unetched, were used to investigate the flashover characteristics of semiconductor under impulse voltage in vacuum. Before flashover, the ohmic current was observed for unetched samples and the space charge limited (SCL) current for etched samples, respectively. Meanwhile both samples showed quite different flashover tracks. It was believed that all the phenomena were due to their different density and distribution of surface states. A new model was proposed to describe the development process of surface flashover along semiconductor, i.e., the thermal effect and subsequently the current filament with the applied voltage. It was suggested that the flashover phenomena occurred in the interface layer of silicon butted to electrodes and in its lateral layer near to the ambient.
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