半导体制造中缓冲HF的资源节约

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.962954

Y. Inagaki, M. Shimizu

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引用次数: 2

摘要

缓冲HF (BHF)是氢氟酸和氟化铵的混合物，用于蚀刻和清洁硅片。废物BHF通常用各种化学品处理，导致大量废水和污泥的排放。我们开发了一种新的方法，通过提供依赖于BHF中nh4 / sub4 /F与HF的比例的元素来延长BHF的周期。这种方法可以减少所需的BHF，减少处理废弃BHF所需的化学品，减少废水和污泥的排放。

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Resource conservation of buffered HF in semiconductor manufacturing

Buffered HF (BHF), which is a mixture of hydrofluoric acid and ammonium fluoride, is used for etching and cleaning silicon wafers. Waste BHF is generally treated with a variety of chemicals, resulting in the discharge of much wastewater and sludge. We have developed a new method to extend the period of BHF can be used by supplying elements which depend on the ratio of NH/sub 4/F to HF in BHF. This method can reduce the BHF required, reduce the chemicals required to treat waste BHF and decrease the discharge of wastewater and sludge.

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来源期刊

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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