K. Nakao, T. Asano, H. Fukushima, H. Yamamoto, A. Dip, R. Joe, D. O'Meara, R. Soave, S. Kaushal
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A new concept in multi-wafer (MW) rapid thermal processing (RTP) is presented. An innovative approach to hot-wall, isothermal processing technology advances the conventional large batch environment into the realm of RTP processing. Using recent developments in heater technology along with advancements in other critical processing areas, a method for processing a lot (25 wafers) within an hour in a hot-wall RTP environment is demonstrated.
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