电沉积法沉积银镍合金单相固溶体

Brij Mohan Mundotiya, W. Ullah, Krishna Kumar
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引用次数: 0

摘要

Ag-Ni薄膜因其在磁性材料、催化剂、光学材料等方面的应用而受到材料科学家和研究人员的关注。在体中,由于原子尺寸和正混合焓的较大差异,银镍合金薄膜的单相固溶体难以形成。然而,在纳米水平上,银和镍组分的不混溶性减弱。电沉积法由于其时间效率、成本效益和大规模生产单相固溶体的能力,已成为合成单相Ag-Ni合金薄膜的最合适方法。在这种方法中,合金元素(即Ag和Ni)的混相性和Ag-Ni薄膜的质量也可以通过调整电沉积工艺参数(如施加电流密度的大小、电解质的温度、电解质中的添加剂等)来轻松控制。本章详细介绍了影响银镍薄膜单固溶体混相、形貌和质量的工艺参数。此外,还详细讨论了Ag-Ni薄膜的成核和生长机理,以及薄膜颗粒曲率对Ag和Ni元素混相的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrodeposition Approaches to Deposit the Single-Phase Solid Solution of Ag-Ni Alloy
The Ag-Ni films have attracted the attention of material scientists and researchers due to its applications as magnetic materials, catalyst, optical materials, etc. In the bulk, the formation of a single-phase solid solution of the Ag-Ni alloy film is difficult due to the large differences in the atomic size and the positive enthalpy of mixing. However, the immiscibility in the Ag and Ni constituents is diminished in the nano-sized level. The electrodeposition method has established itself as a most suitable method for synthesis of single-phase Ag-Ni alloy films due to its time efficiency, cost-effectiveness, and ability to mass production of single-phase solid solutions. In this method, the miscibility of alloying elements (i.e., Ag and Ni) and the quality of the Ag-Ni film can also be easily controlled by tuning the electrodeposition process parameters such as the magnitude of the applied current density, temperature of the electrolyte, additives in electrolytes, etc. This chapter presents a detailed overview of the process parameters affecting the miscibility, morphology, and the quality of the single solid solution of Ag-Ni film. Furthermore, the nucleation and growth mechanism of Ag-Ni film and the effect of the curvature of the deposited film’s particles in the miscibility of the Ag and Ni elements have also been discussed in detailed.
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