{"title":"通过互连和门分离降低延迟不确定性","authors":"Vineet Agarwal, J. Sun, A. Mitev, Janet Roveda","doi":"10.1109/ASPDAC.2007.358067","DOIUrl":null,"url":null,"abstract":"Traditional timing variation reduction techniques are only able to decrease the gate delay variation by incurring a delay overhead. In this work, we propose novel and effective splitting based variation reduction techniques for both interconnect and gate. We developed a new tool called TURGIS: timing uncertainty reduction by gate-interconnect splitting which reduces the timing variations of a circuit and presents little delay overhead at the primary output. It is shown that using splitting on interconnect can reduce the chemical-mechanical polishing (CMP) induced dishing effect and can result in decrease at an average of 5% in mean interconnect delay in addition to its variation. Improvements of up to 30% are achieved on timing variation for gates of various size while reduction of 55% can be observed in interconnect delay variation.","PeriodicalId":362373,"journal":{"name":"2007 Asia and South Pacific Design Automation Conference","volume":"36 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Delay Uncertainty Reduction by Interconnect and Gate Splitting\",\"authors\":\"Vineet Agarwal, J. Sun, A. Mitev, Janet Roveda\",\"doi\":\"10.1109/ASPDAC.2007.358067\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Traditional timing variation reduction techniques are only able to decrease the gate delay variation by incurring a delay overhead. In this work, we propose novel and effective splitting based variation reduction techniques for both interconnect and gate. We developed a new tool called TURGIS: timing uncertainty reduction by gate-interconnect splitting which reduces the timing variations of a circuit and presents little delay overhead at the primary output. It is shown that using splitting on interconnect can reduce the chemical-mechanical polishing (CMP) induced dishing effect and can result in decrease at an average of 5% in mean interconnect delay in addition to its variation. Improvements of up to 30% are achieved on timing variation for gates of various size while reduction of 55% can be observed in interconnect delay variation.\",\"PeriodicalId\":362373,\"journal\":{\"name\":\"2007 Asia and South Pacific Design Automation Conference\",\"volume\":\"36 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-01-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Asia and South Pacific Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.2007.358067\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Asia and South Pacific Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2007.358067","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Delay Uncertainty Reduction by Interconnect and Gate Splitting
Traditional timing variation reduction techniques are only able to decrease the gate delay variation by incurring a delay overhead. In this work, we propose novel and effective splitting based variation reduction techniques for both interconnect and gate. We developed a new tool called TURGIS: timing uncertainty reduction by gate-interconnect splitting which reduces the timing variations of a circuit and presents little delay overhead at the primary output. It is shown that using splitting on interconnect can reduce the chemical-mechanical polishing (CMP) induced dishing effect and can result in decrease at an average of 5% in mean interconnect delay in addition to its variation. Improvements of up to 30% are achieved on timing variation for gates of various size while reduction of 55% can be observed in interconnect delay variation.