基于MCM-D的工作站和PC应用缓存SRAM产品的批量实现

S. Mok
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引用次数: 2

摘要

多芯片模块已经在大量存储应用中使用了十多年。本文概述了MCM- d在高性能SRAM模块系列中的使用,这些模块旨在利用MCM基础架构的一些最新变化。该产品专为大批量,高性能,相对成本敏感的插入而设计,以支持当前和下一代基于微处理器的系统系列。本文讨论了MicroModule System的ChipFrame高速缓存sram的设计与实现。其中包括在28mm 160引脚PQFP标准化之前审查的封装替代方案的讨论,IC供应商和MCM代工厂采用的测试策略,以及产品开发和设计验证中使用的可靠性计划的总结。讨论还将包括使用这些mcm的示例系统实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Volume Implementation of MCM-D Based Cache SRAM Products for Workstation and PC Applications
Multichip modules have been used in large numbers of memory applications for over ten years. This paper outlines the use of MCM-D in a high-performance family of SRAM modules designed to take advantage of a number of recent changes in the MCM infrastructure. The products are designed for high volume, high-performance, relatively cost-sensitive insertions in support of current and next-generation microprocessor-based system families. This paper discusses the design and implementation of MicroModule System's ChipFrame cache SRAMS. Included are a discussion of package alternatives reviewed prior to standardization on 28mm 160-lead PQFP, the test strategies employed by both IC suppliers and the MCM foundry, and a summary of reliability programs used in product development and design verification. The discussion will also include sample system implementations using these MCMs.
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