激光增强直接打印增材制造(LE-DPAM)封装波束成形IC

2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC) Pub Date : 2022-05-29 DOI:10.23919/AT-AP-RASC54737.2022.9814384

Ruoke Liu, J. Braun, Gregory A. Mitchell, Jing Wang, G. Mumcu

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引用次数: 0

摘要

本文首次展示了采用激光增强直接打印增材制造(LE-DPAM)技术封装的24.25-27.5 GHz 4通道差分波束形成集成电路(BFIC) (AWMF-0135)。LE-DPAM允许在多层电子组装结构上直接集成波束成形IC封装、射频(RF)信号和数字控制线。通过利用自动化LE-DPAM平台功能(熔融沉积建模(FDM)，微点胶，铣削和激光微加工)，我们完成了整个封装过程，而无需从印刷床上移除BFIC。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Packaging of a Beamforming IC by Laser Enhanced Direct Print Additive Manufacturing (LE-DPAM)

This paper presents the first demonstration of a 24.25-27.5 GHz 4-channel differential beamforming integrated circuit (BFIC) (AWMF-0135) packaged using a laser-enhanced direct print additive manufacturing (LE-DPAM) technique. LE-DPAM allows for the direct integration of the beamforming IC package, radio frequency (RF) signal, and digital control lines over a multi-layer electronic assembly structure. By taking advantage of the automated LE-DPAM platform capabilities (fused deposition modeling (FDM), microdispending, milling, and laser micromachining), we complete the entire packaging process without removing the BFIC from the printing bed.

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2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC)

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