使用高度弯曲不敏感，无像素化和防水表皮电子元件的保形人机集成。

IF 31.6 1区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Nano-Micro Letters Pub Date : 2023-08-16 DOI:10.1007/s40820-023-01176-5

Chao Wei, Wansheng Lin, Liang Wang, Zhicheng Cao, Zijian Huang, Qingliang Liao, Ziquan Guo, Yuhan Su, Yuanjin Zheng, Xinqin Liao, Zhong Chen

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引用次数: 0

摘要

高效和灵活的交互需要将人类的意图精确地转化为计算机可识别的信号，这对元宇宙的突破性发展至关重要。交互式电子器件面临着实现高精度、稳定的触摸检测但刚性大、体积大、厚度大或实现高柔性穿戴但失去精度的共同困境。在这里，我们构建了高度弯曲不敏感、无像素化和防水的表皮界面(BUW表皮界面)，并展示了它们在保形人机集成中的交互应用。基于可寻址电触点结构的BUW表皮界面具有高精度、稳定的触摸检测、高灵活性、快速响应时间、优异的稳定性和多功能的“剪切-粘贴”特性。无论是平的还是弯曲的，BUW表皮界面都可以与人体皮肤共形连接，实现实时、舒适和不受约束的交互。本研究为表皮电子学的功能复合和结构设计策略的发展提供了新的技术途径，并可能进一步扩大人机交互向超宇宙的发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse

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Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse

Highlights

The addressable electrical contact structure enables the multifunctional epidermal interface with an all-in-one function of sense, recognition, and transmission, which realizes high flexibility and high-precision touch detection.
The multifunctional epidermal interface achieves superior waterproofness and is constructed enough thin to be bent freely, which is not as rigid, bulky, and thick as common interactive electronic device.
The bending-insensitive characteristic facilitates accurate and stable human–machine interactions, which provides a key foundation for intelligent prostheses and super-soft robots.

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来源期刊

Nano-Micro Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

42.40

自引率

4.90%

发文量

715

审稿时长

13 weeks

期刊介绍： Nano-Micro Letters is a peer-reviewed, international, interdisciplinary and open-access journal that focus on science, experiments, engineering, technologies and applications of nano- or microscale structure and system in physics, chemistry, biology, material science, pharmacy and their expanding interfaces with at least one dimension ranging from a few sub-nanometers to a few hundreds of micrometers. Especially, emphasize the bottom-up approach in the length scale from nano to micro since the key for nanotechnology to reach industrial applications is to assemble, to modify, and to control nanostructure in micro scale. The aim is to provide a publishing platform crossing the boundaries, from nano to micro, and from science to technologies.