{"title":"System Level Testing via TLM 2.0 Debug Transport Interface","authors":"S. Carlo, N. Hatami, P. Prinetto, A. Savino","doi":"10.1109/DFT.2009.46","DOIUrl":"https://doi.org/10.1109/DFT.2009.46","url":null,"abstract":"With the rapid increase in the complexity of digital circuits, the design abstraction level has to grow to face the new needs of system designers in the early phases of the design process. Along with this evolution, testing and test facilities should be improved in the early stages of the design to provide the architecture with functional test facilities to be later synthesized testing infrastructures according to designer’s requirements. These test infrastructures could be translated, into testing facilities at lower levels of abstraction, from which automatic synthesis tools are available. Starting from the increasing use of TLM in hardware design industry, the paper aims at providing a mechanism to fill the gap between the design abstraction level and the level in which testing methodologies are applied. To do the job, the TLM 2.0 “debug transport interface” is used and methods are introduced to synthesize it into known test access methods at RTL.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114755553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Resilience Challenges for Exascale Systems","authors":"N. Jouppi","doi":"10.1109/DFT.2009.52","DOIUrl":"https://doi.org/10.1109/DFT.2009.52","url":null,"abstract":"The combination of decreasing device reliability due to deep submicron scaling, increasing integration, and the size of future exascale high-performance computers and cloud datacenters pose significant challenges for system resilience. Furthermore, with power and cost being of critical importance, resilience must be provided efficiently and economically. Although providing resilience will require a range of approaches at all levels of the system stack, the final responsibility rests at the system level. In addition to highlighting challenges, this talk reviews and introduces promising system-level techniques such as configurable isolation, duplication caching, multicore DIMMs, CoVeRT, and 3D checkpointing.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116037325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimization of Nanoelectronic Systems Reliability Under Massive Defect Density Using Distributed R-fold Modular Redundancy (DRMR)","authors":"M. Stanisavljevic, A. Schmid, Y. Leblebici","doi":"10.1109/DFT.2009.54","DOIUrl":"https://doi.org/10.1109/DFT.2009.54","url":null,"abstract":"The theoretical analysis of R-fold modular redundancy with distributed voters -- distributed R-fold modular redundancy, in terms of reliability is presented for the first time to the best of author's knowledge. This technique is compared in terms of resistance to massive levels of defect density expected in future nano-devices to R-fold modular redundancy with a single voter, cascaded R-fold modular redundancy and NAND multiplexing. Optimal partition size analysis and redundancy optimization of distributed R-fold modular redundancy technique has been performed for the first time in the context of a large-scale system. The optimal window of application of different fault-tolerant techniques with respect to defect density is presented as a way to find the optimum design trade-off between the reliability and power/area.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"280 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117342297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thermal Driven Test Access Routing in Hyper-interconnected Three-Dimensional System-on-Chip","authors":"Unni Chandran, Dan Zhao","doi":"10.1109/DFT.2009.42","DOIUrl":"https://doi.org/10.1109/DFT.2009.42","url":null,"abstract":"The rapid emergence of three dimensional integration using a ``Through-Silicon-Via'' (TSV) process calls for research activities on testing and design for testability. Compared to the traditional 2D designs, the 3D-SoC poses great challenges in testing, such as three dimensional placement of cores and test resources, severe chip overheating due to the nonuniform distribution of power density in 3D, and 3D test access routing. In this work, we propose an effective and efficient test access routing and resource partitioning scheme to tackle the 3D-SoC test challenges. We develop a simple and scalable 3D-SoC test thermal model for thermal compatibility analysis. We construct a 3-D test access architecture for efficient test access routing, and partition the limited test resources to facilitate a thermal-aware test schedule while minimizing the overall test time. The promising results are demonstrated by extensive simulation on ITC'02 benchmark SoCs.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123818091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"SNR-Aware Error Detection for Low-Power Discrete Wavelet Lifting Transform in JPEG 2000","authors":"Shih-Hsin Hu, Tung-Yeh Wu, J. Abraham","doi":"10.1109/DFT.2009.17","DOIUrl":"https://doi.org/10.1109/DFT.2009.17","url":null,"abstract":"This paper presents a SNR-aware error detection technique for a low-power wavelet lifting transform architecture in JPEG 2000. Power reduction is done by over-scaling the supply voltage (voltage-over-scaling (VOS)). A low-cost SNR-aware detection logic is integrated into the discrete wavelet lifting transform architecture, to check if the image quality degradation caused by the resulting timing errors is acceptable, in order to determine the optimal voltage setting in operating condition at run time. The technique behind the SNR-aware detection logic is the weighted checksum code. It is shown that image quality measured in SNR can be correlated with the image checksum difference. If the image checksum difference is above a certain threshold, the SNR of the image will be below the minimal requirement and image quality will be unacceptable. This novel quality-based error detection is significantly different from traditional error detection schemes which look for exact data equivalence. The technique is useful in exploring optimal voltage configurations for Dynamic Voltage Scaling (DVS).","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124070337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Stelios N. Neophytou, M. Michael, Kyriakos Christou
{"title":"Generating Diverse Test Sets for Multiple Fault Detections Based on Fault Cone Partitioning","authors":"Stelios N. Neophytou, M. Michael, Kyriakos Christou","doi":"10.1109/DFT.2009.24","DOIUrl":"https://doi.org/10.1109/DFT.2009.24","url":null,"abstract":"Testing modeled faults multiple times has been shown to increase the likelihood of a test set to detect non-modeled faults, either static or dynamic, when compared to a single detect test set. Test sets that guarantee detecting every modeled fault with at least n different tests are known as n-detect test sets. Moreover, recent investigations examine how different the various tests for a fault should be, in order to further increase their ability in detecting defects. This work proposes a new test generation methodology for multiple-detect (including n-detect) test sets that increases their diversity in terms of the various fault propagation paths excited by the different tests. Specifically, the various tests per modeled fault are guaranteed to propagate the fault effect via different propagation paths. The proposed method can be applied to any linear, to the circuit size, static or dynamic fault model for multiple fault detections, such as the stuck-at or transition delay fault models, and avoids any path or path segment enumeration. Experimental results show increased numbers of propagation paths and non-modeled fault coverages when compared to traditional n-detect test sets.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122185002","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Fault Analysis and Classifier Framework for Reliability-Aware SRAM-Based FPGA Systems","authors":"C. Bolchini, F. Castro, A. Miele","doi":"10.1109/DFT.2009.10","DOIUrl":"https://doi.org/10.1109/DFT.2009.10","url":null,"abstract":"This paper presents a new framework for the analysis of SRAM-based FPGA systems with respect to their dependability properties against single, multiple and cumulative upsets errors. The aim is to offer an environment for performing fault classification and error propagation analyses for designed featuring fault detection or tolerance techniques against soft errors, where the focus is not only the overall achieved fault coverage, but an understanding of the fault/error relation inside the internal elements of the system. We propose a fault analyzer/classifier laying on top of a classical fault injection engine, used to monitor the evolution of the system after a fault as occurred, with respect to the applied reliability-oriented design technique. The paper introduces the framework and reports some experimental results of its application to a case study, to highlight the benefits of the proposed solution.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123311702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Study of Side-Channel Effects in Reliability-Enhancing Techniques","authors":"Jianwei Dai, Lei Wang","doi":"10.1109/DFT.2009.32","DOIUrl":"https://doi.org/10.1109/DFT.2009.32","url":null,"abstract":"Reliability-enhancing techniques are critical for nanoscale integrated systems under the pressure of various physical non-idealities such as process variations and manufacturing defects. However, it is unclear how these techniques will affect the side-channel information leaked through hardware implementations. The related side-channel effects may have direct implications to the security requirement in a wide range of applications. In this paper, we investigate this new problem for trusted hardware design. Employing information-theoretic measures, the relationship between reliability enhancements and the induced side-channel effects is quantitatively evaluated. Simulation results on EDC/ECC schemes in memory circuits are presented to demonstrate the application of the proposed method.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129028893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Coded DNA Self-Assembly for Error Detection/Location","authors":"Z. M. Arani, M. Hashempour, F. Lombardi","doi":"10.1109/DFT.2009.13","DOIUrl":"https://doi.org/10.1109/DFT.2009.13","url":null,"abstract":"This paper proposes a novel framework in which DNA self-assembly can be analyzed for error detection/ location. The proposed framework relies on coding and mapping functions that allow to establish the presence of erroneous bonded tiles based on the pattern to be assembled (as defined by the tile set) and its current aggregate. As a widely used pattern and instantiation of this process, the Sierpinski Triangle self-assembly is analyzed in detail.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124411941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Defect-Tolerant Logic Mapping on Nanoscale Crossbar Architectures and Yield Analysis","authors":"Yehua Su, Wenjing Rao","doi":"10.1109/DFT.2009.16","DOIUrl":"https://doi.org/10.1109/DFT.2009.16","url":null,"abstract":"Crossbar architectures are promising in the emerging nanoelectronic environment. However, fabrication processes for nano-scale circuits introduce numerous defects. Logic mapping on these defective nanofabrics thus emerges as a fundamental challenge. We establish a mathematical model for the logic mapping problem, followed by a probabilistic analysis to gain yield information. Since the most challenging part of the problem is the exponential runtime in searching for a solution, we examine the practical perspective of yield where a runtime limit is imposed. Yield improvement can be achieved through one of two ways: adding hardware redundancy by increasing crossbar size or allowing longer runtime. It turns out that correlations in the mapping solution space play an essential role on the complexity of the problem. Therefore, developing effective mechanisms to improve yield requires insights and analysis on correlations in the solution space. The analysis provided in this paper reveals the following points. Even though yield can always be improved through increasing crossbar size, the improvement gained by increasing crossbar size has a theoretical upperbound when a runtime limit is imposed. Consequently, there exists an optimal size for a crossbar to improve yield effectively within a runtime limit. Last but not least, for large-sized logic functions, longer runtime can be invested to improve yield significantly.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125319895","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}