2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)最新文献_第8页

Comprehensive cost-effective photo defect monitoring strategy 全面的高性价比的光缺陷监测策略

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962916

I. Peterson, M. Stoller, D. Gudmundsson, R. Nurani, S. Ashkenaz, L. Breaux

{"title":"Comprehensive cost-effective photo defect monitoring strategy","authors":"I. Peterson, M. Stoller, D. Gudmundsson, R. Nurani, S. Ashkenaz, L. Breaux","doi":"10.1109/ISSM.2001.962916","DOIUrl":"https://doi.org/10.1109/ISSM.2001.962916","url":null,"abstract":"The latest technology advances and new processes in the lithography area coupled with the increasing market pressures have placed greater demands on defect management. Thinner resists, new resist chemistries and tighter process windows along with shorter product life cycles and the need for faster return on investment create the necessity to focus more attention to defectivity. Fabs must detect, identify and resolve defects in the lithography area before committing product wafers in order to be competitive. At present, the application of available advanced defect management technology in the lithography area has lagged compared to other areas in the semiconductor fab. Optimizing the defect management strategy with the large range of possible defect mechanisms and related yield impact that can occur within the lithography area is a relatively complicated task. With the variety of available defect inspection technologies, the capital and labor support costs associated with defect metrology and the ability to correct problems by rework, there is a need to approach the problem of defect management in, a systematic, manner to measure the cost effectiveness of the defect management strategy. In this paper the Sample Planner cost model was applied to the full range of available defect inspection technologies and sampling strategies based on the commonly known defect mechanisms that occur in the lithography area. From this a recommended optimum sampling and monitoring strategy was obtained.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129761927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

The development of security system and visual service support software for on-line diagnostics 在线诊断安全系统及可视化服务支持软件的开发

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962911

M. Inaba, T. Aizono, K. Sonobe, H. Fukube, T. Iizumi, J. Arima, Y. Usami

引用次数: 8

Towards a complete plasma diagnostic system 迈向完整的血浆诊断系统

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962933

Z. Wu, C. Spanoc

引用次数: 3

Improvement of 300mm FOUP mini-environment 300mm FOUP微环境改进

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.963025

H. Seita, A. Fujii, T. Suzuki, S. Kimoto, O. Shippou, K. Fujiwara, K. Tokunaga

引用次数: 1

Development of automated contact inspection system using in-line CD SEM 在线CD扫描电镜自动接触检测系统的开发

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962999

Sang-mun Chon, S. Choi, Yong-Wan Kim, Kye-Weon Kim, Kyu-hong Lim, Sun-Yong Choi, C. Jun

{"title":"Development of automated contact inspection system using in-line CD SEM","authors":"Sang-mun Chon, S. Choi, Yong-Wan Kim, Kye-Weon Kim, Kyu-hong Lim, Sun-Yong Choi, C. Jun","doi":"10.1109/ISSM.2001.962999","DOIUrl":"https://doi.org/10.1109/ISSM.2001.962999","url":null,"abstract":"We have developed an automated contact inspection system using an in-line CD SEM and applied it to monitor contact etching processes. As the design rule shrinks, monitoring of the contact etching, which cannot be detected by the conventional optical inspection systems, are becoming one of the most critical issues in semiconductor processing. Though there are e-beam based inspection systems or manual inspection sequence with in-line SEM (Scanning Electron Microscope), monitoring small and electrical defects has a few fundamental limitations. E-beam inspection systems have low throughput and a high price as a mass production tool. In the case of the manual inspection system, the inspection result depends on the operator and it is difficult to quantify the defect data. We have developed an automated contact inspection system to overcome these limitations. The system is composed of a data processing system and an in-line SEM. The automated in-line SEM inspects and stores the images of specified points on the wafer. The data processing system receives and manipulates the images to indicate the etching problem. It was shown that the scanning electron image of the contact is related to failures such as insufficient etching or residuals inside the contact.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130577142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Development of data logging system for chemical mechanical polishing and its application for process control 化学机械抛光数据记录系统的研制及其在过程控制中的应用

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.963010

A. Tanzawa, T. Igarashi, S. Matsuzaki, T. Suzuki, K. Tokushige

引用次数: 3

Reconciling high-speed scheduling with dispatching in wafer fabs 协调高速调度与晶圆厂调度

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962926

M. Johnston

引用次数: 2

A non-traditional approach to resolving multi-layer process-induced metal voiding 解决多层工艺引起的金属空洞的非传统方法

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962967

S. Doan, Boon Ang

引用次数: 0

Wafer level tracking and control to full mini-environment line 晶圆级跟踪和控制全迷你环境线

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962912

K. Uriga, B. Crandell

引用次数: 0

An automatic monitor management system for effective 300 mm fab operations 一个自动监控管理系统，有效的300毫米晶圆厂操作

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI: 10.1109/ISSM.2001.962924

Chung-Shen Wu, Da-Yin Liao

引用次数: 0