2009 32nd International Spring Seminar on Electronics Technology最新文献_第9页

The capacitive sensor 电容式传感器

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207049

P. Kosina, L. Hájková, J. Šandera, Tomas Symersky

引用次数: 8

Sensorial characteristics of conductive polymers 导电聚合物的感觉特性

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207063

J. Řeboun, A. Hamácek, T. Džugan, M. Kroupa

引用次数: 6

Some simulated properties of the pseudostructure of a floating gate MOS transistor 浮栅MOS晶体管伪结构的一些模拟特性

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207000

D. Durackova, Mário Krajmer, J. Racko, J. Breza, M. Kadlecíková

引用次数: 0

A quasi real time simulator for Maximum Power Point Tracking algorithms 最大功率点跟踪算法的准实时模拟器

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207007

A. Rusu, D. Petreus, I. Ciocan, D. Moga

引用次数: 1

Robust ceramic capillary electrophoresis analysis device 坚固的陶瓷毛细管电泳分析装置

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207045

G. Fercher, W. Smetana, M. Vellekoop

引用次数: 0

Modeling and simulation of an recognition system for digital modulated signals 数字调制信号识别系统的建模与仿真

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206992

D. Visan, M. Jurian, I. Lita, I. B. Cioc

引用次数: 2

Novel interdigitated transducer structures for biosensoric applications 用于生物传感应用的新型交叉式传感器结构

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206978

A. Bonyár, H. Santha

{"title":"Novel interdigitated transducer structures for biosensoric applications","authors":"A. Bonyár, H. Santha","doi":"10.1109/ISSE.2009.5206978","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206978","url":null,"abstract":"In this work we present novel interdigitated transducer (IDT) structures and their electrochemical characterization for DNA (deoxiribo-nucleic-acid) based biosensoric applications. The principle of the new structures is to maximize the so called “edge effect” of the electric field to gain faster material transfer and thus increase the performance of the biosensor. For the characterization of the gold thin film IDT structures we used electrochemical impedance spectroscopy (EIS) with three different electrode connecting regimes and single-stranded DNA monolayers. Experiments were performed to evaluate two aspects. A). The new IDT structures were evaluated based on the maximal possible signal that can be gained after hybridization of the ssDNA (single stranded) biofunctionalized electrodes and the target ssDNA chains. Results suggest that using the new electrode structures instead of the classical round shaped working electrodes is not entirely beneficial. B). In the other aspect of the experiments some electrode connecting regimes among the investigated three ones can be considered beneficial or disadvantageous in terms of sensitivity or reproducibility.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"219 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131540901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Printed circuit boards with different material core assembling quality analysis based on 4 P Soldering Model 基于4p焊接模型的不同材料印刷电路板芯装配质量分析

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207053

P. Svasta, I. Plotog, N. Codreanu, A. Vasile, G. Vărzaru, A. Marin

{"title":"Printed circuit boards with different material core assembling quality analysis based on 4 P Soldering Model","authors":"P. Svasta, I. Plotog, N. Codreanu, A. Vasile, G. Vărzaru, A. Marin","doi":"10.1109/ISSE.2009.5207053","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207053","url":null,"abstract":"The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and lowering costs for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core. Taking into account only rigid PCBs, there are currently used metals (Al, Cu, brass), for applications requiring excellent thermal management (RF modules, power leds), or glass, for applications requiring high levels of cleanliness (medical apparatus), or specific polytetrafluoroethene (PTFE) materials for microwave applications (Arlon, Rogers). In the practice, the Electronics Manufacturing Services (EMS) companies become to have difficulties for assembling the PCBs with different core materials determined by high thermal capacity being hardly to adjust the Surface-mount technology (SMT) lines parameters. In this paper it is analyzed the influence of the PCB support over some of the parameters of 4P Soldering Model and the consequences on the quality of the soldering. There were used four types of boards with different types of pad finishes, same solder paste, same pin finishes and two different processes. The results are undeniably that PCB support material is very important for the statement of the thermal profile of the process.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131343064","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Technological and design limitations of bipolar power transistors 双极功率晶体管的技术和设计限制

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206928

V. Strakoš

引用次数: 0

Actuators to be integrated in Low Temperature Cofired Ceramics (LTCC) microfluidic systems 在低温共烧陶瓷(LTCC)微流控系统中集成致动器

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207068

H. Klumbies, U. Partsch, A. Goldberg, S. Gebhardt, U. Keitel, H. Neubert

{"title":"Actuators to be integrated in Low Temperature Cofired Ceramics (LTCC) microfluidic systems","authors":"H. Klumbies, U. Partsch, A. Goldberg, S. Gebhardt, U. Keitel, H. Neubert","doi":"10.1109/ISSE.2009.5207068","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207068","url":null,"abstract":"LTCC technology has recently been used for microfluidic elements, e.g. channels, cavities and other passive fluidic components. However, microfluidic systems having enhanced functionality, e.g. differential pressure sensors, dosing devices and pumps, require active components that include electrically driven actuators. Up to now, only piezo-cantilevers, electromagnetic and thermo-pneumatic actuators have been engineered for the LTCC integration [1–4]. Due to their specific properties, they are not suitable for all applications that require an actuator. Therefore, a review on actuators capable of being integrated in LTCC is given. On the one hand, the actuators are compared according to their functional properties, e.g. stroke and switching energy, so that actuators can be figured out that fulfil the requirements of a microfluidic system to be designed. On the other hand, the technological challenges to be coped with in the integration of the actuators are listed. Both the functional properties of an actuator and the possibility to integrate it decide on the suitability for a specific application. Using our evaluation method, we introduced actuators for two different microfluidic applications, a piezo-electrically controlled throttle for a DMFC (Direct Methanol Fuel Cell) application and an electrostatic valve for a differential pressure sensor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126206156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16