2009 32nd International Spring Seminar on Electronics Technology最新文献

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Electrodes modified by carbon nanotubes for pressure measuring 碳纳米管修饰的压力测量电极
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206959
J. Pekárek, R. Ficek, R. Vrba, M. Magat
{"title":"Electrodes modified by carbon nanotubes for pressure measuring","authors":"J. Pekárek, R. Ficek, R. Vrba, M. Magat","doi":"10.1109/ISSE.2009.5206959","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206959","url":null,"abstract":"This paper describes a new approach to pressure sensors development using field emission and capacitive principles. Both sensors consist of two high doped silicon electrodes. Usually, for both pressure measurements, one electrode is anisotropic etched to obtain a sensitive membrane and the other one is solid with a carbon nanotubes (CNTs) array. The field emission sensor works on the principle that the field emission current is correlated with the electrical field intensity, i.e. the anode-emitter distance when the applied voltage is fixed. The capacitive sensor takes advantage of CNTs dimensions to increase the surface. This means that the CNTs array in the emission sensors serves as the emitter source of electrons between the cathode and the anode in the electric field and the CNTs arrays in the capacitive sensors increase the surface of the electrodes, which are similar to a plate capacitor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"s3-4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130174444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Real-time monitoring of electrochemical migration during environmental tests 环境试验过程中电化学迁移的实时监测
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207046
B. Medgyes, R. Berényi, L. Jakab, G. Harsányi
{"title":"Real-time monitoring of electrochemical migration during environmental tests","authors":"B. Medgyes, R. Berényi, L. Jakab, G. Harsányi","doi":"10.1109/ISSE.2009.5207046","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207046","url":null,"abstract":"More and more reliability and quality problems of electrical assemblies have to be solved due to the trend of miniaturization and the even higher level of integration. In some cases these failures can lead to catastrophic failure. The phenomenon of electrochemical migration is one of the most dangerous failure mechanism which usually results in short resistive circuits. In this paper electrochemical migration (ECM) failure phenomena is be investigated which was real-time monitored by the measurements of electrical parameters of conductor patterns with immersion Ag and immersion Ag finish coated with Sn60Pb on Printed Wiring Boards (PWB.) Highly Accelerated Stress Test (HAST) and Thermal Humidity Bias (THB) tests were carried out and Mean Time To Failure (MTTF) comparison was investigated between immersion Ag and immersion Ag coated with Sn60Pb.Only preliminary investigations were presented in order to determine the steps of the full ECM process on different substrates, surface finishes, solder alloys under various climatic conditions. The key findings were that the MTTFs during HAST tests were significantly shorter than in case of THB tests.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130318722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Investigation of metrological characteristics of digital sinewave generator 数字正弦波发生器计量特性研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206940
K. Stefanova, B. Koen, I. Petrov
{"title":"Investigation of metrological characteristics of digital sinewave generator","authors":"K. Stefanova, B. Koen, I. Petrov","doi":"10.1109/ISSE.2009.5206940","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206940","url":null,"abstract":"The paper presents the analysis of the amplitude absolute error of a digital sinewave generator with step approximation and step-linear approximation. Further in the paper is presented an investigation of the spectrum of digital sinewave generator signal. Non-linear distortion (NLD) of digital sinewave with step and step-linear approximation is analysed. The non-linear distortion is calculated in order find the approximation with smaller NLD. Up to this paper is made cooperative analysis of the amplitude absolute error of digital sinewive generator with linear approximation and step-linear approximation.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121687989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Image analysis of solder spread factor on different material types 不同材料类型上焊料扩散系数的图像分析
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207059
K. Dušek, J. Martinek
{"title":"Image analysis of solder spread factor on different material types","authors":"K. Dušek, J. Martinek","doi":"10.1109/ISSE.2009.5207059","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207059","url":null,"abstract":"This article deals with the image analysis of the solder spread factor on the different material types and surface finishes. The spread factor of the solders is one of the tools which should be used to solderability and wetability quantification. Two types of solders (Sn62Pb36Ag2, Sn95,5Ag4Cu0,5) four types of material (lead free H.A.L., passivated copper, immersion tin plating, chemical gold plating) ware used in experiment. Three types of different roughness of the surface finish were used in case of cooper material. The differences between the solder spread factor on the different types of material and surface finishes ware evaluated by image analysis of the spread factor surface.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121388816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Comparative study of GaPO4, langasite, and LiNbO3 properties with application in Surface Acoustic Waves microdevices GaPO4、langasite和LiNbO3在表面声波微器件中的应用比较研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207062
P. Schiopu, I. Cristea, N. Grosu, A. Craciun
{"title":"Comparative study of GaPO4, langasite, and LiNbO3 properties with application in Surface Acoustic Waves microdevices","authors":"P. Schiopu, I. Cristea, N. Grosu, A. Craciun","doi":"10.1109/ISSE.2009.5207062","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207062","url":null,"abstract":"The results of research into Surface Acoustic Wave — SAW — devices have been recognized for their efficiency and versatility in the electrical signals processing. Actual progress in the industrial application of piezoelectric materials such as Lithium Niobate (LiNbO3), Langasite (LGS), Lanthanum-Gallium Silicate La3Ga5SiO14 and Gallium Orthophosphate (GaPO4), allows the manufacturing of devices with performances, which overcome the limits obtained with quartz crystals. One of the most important applications of SAW microdevices is passively, wirelessly interrogating systems. Today, GaPO4 with its properties is by far the best suited piezoelectric material to be used in sensor applications for machine monitoring and pressure measurements, at high temperatures. SAW microdevices based on GaPO4 operate at temperatures of up to 800°C. In this paper is presented a short introduction regarding the actual level of SAW microdevices development. We discuss our investigations as a comparative study of GaPO4, Langasite, and LiNbO3, regarding their properties. Each has unique strengths and weaknesses giving advantages in different applications. Conclusions regarding trends in the development of SAW sensor devices with novel materials are presented in the end of the work.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"48 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120822130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Simulating embedded targets for efficient code implementation 模拟嵌入式目标,实现高效的代码
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206997
M. Muresan, D. Pitica
{"title":"Simulating embedded targets for efficient code implementation","authors":"M. Muresan, D. Pitica","doi":"10.1109/ISSE.2009.5206997","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206997","url":null,"abstract":"Nowadays design of embedded systems for controlling processes requires high complexity software modules. In this way, the automatic code generation approach for designing such embedded systems seems to be the most competitive solution in terms of cost-effectiveness and performance","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"87 9","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120865337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Analyze of the environment temperature effect over hydro-energetic buildings resistive transducers 环境温度对水能建筑电阻式传感器的影响分析
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207035
S. Pop, D. Pitica, I. Ciascai, V. Bande
{"title":"Analyze of the environment temperature effect over hydro-energetic buildings resistive transducers","authors":"S. Pop, D. Pitica, I. Ciascai, V. Bande","doi":"10.1109/ISSE.2009.5207035","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207035","url":null,"abstract":"This paper makes a thermal study of a portable temperature measurement device under the influence of environment temperature. The portable device is used to measure sensors placed inside and outside of a hydro-energetic building (dams), where the ambient temperature range is between —20°C÷35°C. The self-heating phenomenon of electronics components cumulated with the ambient temperature increases the packaging temperature which affects the device measurement procedure. The usual electronic component that is affected by temperature variation is the resistor and the analog to digital convector, but the most significant error is caused by resistors. A through hole resistor used as a reference, with temperature coefficient of 10ppm/°C and tolerance of 1%, generates a measurement temperature error of 2.5 °C - with a 0.1% tolerance the error is reduced by 10 times. Modeling the temperature resistor behavior, the accuracy of measurement device can be less that 0.02°C. To establish the resistor temperature model a thermal imaging analyze is been made and using a microcontroller as a central unit, the temperature error can be eliminate by soft. The PCB components placement and positioning can be also optimized using the thermal image.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"123 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134179743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electrical properties of PEDOT PEDOT的电学性能
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207058
T. Džugan, T. Blecha, A. Hamácek, M. Kroupa, J. Řeboun
{"title":"Electrical properties of PEDOT","authors":"T. Džugan, T. Blecha, A. Hamácek, M. Kroupa, J. Řeboun","doi":"10.1109/ISSE.2009.5207058","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207058","url":null,"abstract":"This article deals with electric properties of metal-organic semiconductor junction. Different types of substrates were used for measurement of electrical parameters of poly(3,4-ethylenedioxythiophene) (PEDOT). On these substrates, the thick layer of PEDOT was created. Current-voltage characteristics were measured to find-out if Schottky barrier on the metal-emiconductor junction is created. Then frequency characteristics were measured to obtain an equivalent circuit of this system.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134313297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Vapor-liquid-solid growth of ZnO nanostructure ZnO纳米结构的气-液-固生长
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206964
J. Podzemský, W. Schade
{"title":"Vapor-liquid-solid growth of ZnO nanostructure","authors":"J. Podzemský, W. Schade","doi":"10.1109/ISSE.2009.5206964","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206964","url":null,"abstract":"In our research we focused on one of methods how to create nanostructure of single crystal of zinc oxide (ZnO). Chosen method was vapor-liquid-solid method. With this method the well aligned wires of single crystal of ZnO can be created on different substrates. In our case we used silicon, sapphire, silica glass and ordinary glass used in laboratory (slide). There are two kinds of morphology of these nanowires. They can be perpendicular to the surface or can have mismatch structure. The ordering strongly depends on the type of substrate — on it crystal system. Perpendicular ones were reached on sapphire substrate, with mismatch structure on silicon and silica glass. No zinc oxide nanowires grown on ordinary glass for laboratory purpose. The length of the wires was from 5 µm to 20 µm. The diameter was from 50 nm to hundreds of nm.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"190 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131946448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electronics and its impact on energy and the environment 电子产品及其对能源和环境的影响
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206941
N. Sinnadurai, H. Charles
{"title":"Electronics and its impact on energy and the environment","authors":"N. Sinnadurai, H. Charles","doi":"10.1109/ISSE.2009.5206941","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206941","url":null,"abstract":"Technology's impact on human health has been a concern for at least 200 years. These concerns ranged from the waste and pollution due to mining and heavy manufacturing to emissions from the automobile and fossil fuel power plants. Now the proliferation of electronics products, their manufacture and disposal are posing additional threats to the fragile balance of the Earth's eco systems. Nevertheless, electronics can also be the solution to many of our current and future environmental and energy related problems. The environmental threats from electronics can be significantly reduced or eliminated through consciously environmentally responsible choice of materials, technology, design, manufacture, distribution, usage, and end-of-life disposal. In a similar way the application of electrical and electronics technologies and devices for power generation, electric and hybrid automobiles and solid-state lighting can significantly positively contribute to reducing mankind's carbon footprint and improve our environment. Thus, consciously and demonstrably, electronics technologies, devices and applications are making major contributions through the removal of toxins and pollutants; innovative materials enable reduction in use of other materials; new electronics energy sources will become the long-term major sustainable sources; solid state lighting is decreasing the consumption of energy whilst providing improved illumination. Nano-electronics products now enable more efficient use of energy in many walks of life","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127690654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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