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2009 32nd International Spring Seminar on Electronics Technology最新文献

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Application of wavelet transform to train spring system diagnostics 小波变换在列车弹簧系统诊断中的应用
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206944
G.D. Geshev, E. Dimitrov, N. Nenov
{"title":"Application of wavelet transform to train spring system diagnostics","authors":"G.D. Geshev, E. Dimitrov, N. Nenov","doi":"10.1109/ISSE.2009.5206944","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206944","url":null,"abstract":"The paper examines the train spring system diagnostics problem. The rail disturbances have stochastic nature. This allows acquisition of data containing useful information. Real-time data have been collected during the normal operation. Different data processing methods have been applied, among which the wavelet transform has shown the most relevant and reliable information. Data processing program has been developed for MATLAB® numeric environment. Data processing determines the damper system condition parameters. The logarithmic damping decrement is the main parameter.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126007311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modification of detection process on ZnO sensors by ultraviolet radiation 紫外辐射对氧化锌传感器检测工艺的改进
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207072
Jakub Napravnik, V. Myslík, M. Vrňata, F. Vysloužil, P. Fitl, Dušan Kopecký, J. Vlcek
{"title":"Modification of detection process on ZnO sensors by ultraviolet radiation","authors":"Jakub Napravnik, V. Myslík, M. Vrňata, F. Vysloužil, P. Fitl, Dušan Kopecký, J. Vlcek","doi":"10.1109/ISSE.2009.5207072","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207072","url":null,"abstract":"The contribution deals with influence of radiation in the near UV region (λ = 396 nm) on detection properties of conductive type gas sensors. The ZnO active layers of the sensors were deposited on Alumina substrates by Pulsed Laser Deposition method. Resulting thickness of active layers was ∼ 450 nm. The dc-sensitivity was evaluated from resistance change under exposition of hydrogen and acetone and toluene vapours in synthetic air. The sensitivity to acetone was doubled using the UV radiation at 250°C.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132565910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bladder cancer cell imaging system 膀胱癌细胞成像系统
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206970
M. Weilguni, W. Smetana, M. Edetsberger, G. Kohler
{"title":"Bladder cancer cell imaging system","authors":"M. Weilguni, W. Smetana, M. Edetsberger, G. Kohler","doi":"10.1109/ISSE.2009.5206970","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206970","url":null,"abstract":"A system for observing bladder cancer cells in form of a miniaturized fluorescence microscope has been developed. Attention has turned to integrate this system in an existing LTCC (Low Temperature Cofired Ceramics) module. Software with a region detecting algorithm has been written to automatically detect the captured images. The cancer specimen was marked with hypericin, which is selective on bladder cancer cells. After coloring the specimen was excited with green light of a high power LED. The red emitting hypericin marked cells were captured by a CMOS chip and evaluated with the software to confirm or negate a suspicion of cancer.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132689640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of Si interlayer on nickel and platinum ohmic contacts for N-type SiC Si中间层对n型SiC中镍和铂欧姆触点的影响
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207061
P. Machac, B. Barda
{"title":"Effects of Si interlayer on nickel and platinum ohmic contacts for N-type SiC","authors":"P. Machac, B. Barda","doi":"10.1109/ISSE.2009.5207061","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207061","url":null,"abstract":"Platinum and nickel contacts with and without silicon addition were prepared and compared on 4H and 6H silicon carbide. After deposition, samples were gradually annealed up to 1150°C. Si addition into Pt contact was beneficial for decreasing of contact resistivity on 4H-SiC, but on 6H-SiC the effect was negligible. In the case of Ni-based contacts, the influence of Si was more pronounced for samples on 6H-SiC substrate, but after annealing at temperatures higher than 850°C similar values of contact resistivity were achieved for contacts with different Ni-Si ratio on both 4H and 6H-SiC.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133368810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Solder paste shelf life extending approach for prototyping and small series activities 焊锡膏保质期延长方法的原型和小系列活动
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207037
I. Plotog, P. Svasta, T. Cucu, A. Vasile, A. Marin
{"title":"Solder paste shelf life extending approach for prototyping and small series activities","authors":"I. Plotog, P. Svasta, T. Cucu, A. Vasile, A. Marin","doi":"10.1109/ISSE.2009.5207037","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207037","url":null,"abstract":"In case of prototyping and small series it can be identified a common practical issue for EMS (Electronic Manufacturing Services) companies, especially in case of prototyping and small series activities, regarding solder paste loss percent, production costs and solder joints reliability consequences. Although the solder pastes producers assure minimum 8 hours stencil life-STL (the warranted solder pastes in printing period usage) for printing or dispensing in the recommended ambient conditions: temperature 22° to 28°C and 30%–70% relative humidity, and over six months shelf life-SHL (the shelf warranted storage period in the determined ambient conditions), the solder pastes loss percent goes over 20% in these cases. Process engineers allow to use solder pastes after SHL to and over STL limits [2], in order to reduce loses and implicit costs, taking (or not) into consideration possible solder joints reliability implications. Taking into consideration the solder pastes, as part of 4P Soldering Model for solder joints reliability analyze, in the paper will be presented the study done to find solution for prolonging SHL over producer data, maintaining their properties. The work will be used to develop acceptance methods for solder paste usage after SHL.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129307480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Actuators to be integrated in Low Temperature Cofired Ceramics (LTCC) microfluidic systems 在低温共烧陶瓷(LTCC)微流控系统中集成致动器
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207068
H. Klumbies, U. Partsch, A. Goldberg, S. Gebhardt, U. Keitel, H. Neubert
{"title":"Actuators to be integrated in Low Temperature Cofired Ceramics (LTCC) microfluidic systems","authors":"H. Klumbies, U. Partsch, A. Goldberg, S. Gebhardt, U. Keitel, H. Neubert","doi":"10.1109/ISSE.2009.5207068","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207068","url":null,"abstract":"LTCC technology has recently been used for microfluidic elements, e.g. channels, cavities and other passive fluidic components. However, microfluidic systems having enhanced functionality, e.g. differential pressure sensors, dosing devices and pumps, require active components that include electrically driven actuators. Up to now, only piezo-cantilevers, electromagnetic and thermo-pneumatic actuators have been engineered for the LTCC integration [1–4]. Due to their specific properties, they are not suitable for all applications that require an actuator. Therefore, a review on actuators capable of being integrated in LTCC is given. On the one hand, the actuators are compared according to their functional properties, e.g. stroke and switching energy, so that actuators can be figured out that fulfil the requirements of a microfluidic system to be designed. On the other hand, the technological challenges to be coped with in the integration of the actuators are listed. Both the functional properties of an actuator and the possibility to integrate it decide on the suitability for a specific application. Using our evaluation method, we introduced actuators for two different microfluidic applications, a piezo-electrically controlled throttle for a DMFC (Direct Methanol Fuel Cell) application and an electrostatic valve for a differential pressure sensor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126206156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
An improvement on empirical modelling of the batteries 电池经验模型的改进
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207015
D. Cadar, D. Petreus, I. Ciocan, P. Dobra
{"title":"An improvement on empirical modelling of the batteries","authors":"D. Cadar, D. Petreus, I. Ciocan, P. Dobra","doi":"10.1109/ISSE.2009.5207015","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207015","url":null,"abstract":"Batteries are devices that convert chemical energy contained in its active materials into electric energy throughout electrochemical red-ox reactions. Theoretically, the energy provided by a battery depends only on its active substances. Practically, just a part of a battery's capacity can be used, due to the nonreactive substances that add up to the process and which influence the magnitude of the charge-transfer reaction, diffusion rates and energy losses. In this paper five methods for modeling the batteries were presented, and one improved empirical model was implemented. The empirical model was built using Mathcad and was validated through the comparison of the experimental obtained characteristics with the ones given by the producer.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116631629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Investigation of thermal conductivity of PCB PCB热导率的研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207019
A. Andonova, Nadezda Kafadarova, V. Videkov, S. Andreev
{"title":"Investigation of thermal conductivity of PCB","authors":"A. Andonova, Nadezda Kafadarova, V. Videkov, S. Andreev","doi":"10.1109/ISSE.2009.5207019","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207019","url":null,"abstract":"The thermal conductivity of PCB structures variations according to the position of the metal layers as a function of the local copper contents and distribution are studied. The value of the parallel and serial thermal conductivity coefficient of PCB have been calculated by usage of the corresponding electrical analogs of parallel and serial resistive systems. Solutions were obtained for two PCB thicknesses. Cases with and without a copper layer on the component side were investigated. Simulated results are verified with infrared thermovision measurements.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114593950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation 基于TCAD器件仿真的高压CMOS双极ESD电源钳
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206981
P. Běťák
{"title":"Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation","authors":"P. Běťák","doi":"10.1109/ISSE.2009.5206981","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206981","url":null,"abstract":"The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114902987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of cleaning in electronics production process 电子产品生产过程的清洁评价
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207064
M. Bursik, I. Szendiuch, V. Sítko
{"title":"Evaluation of cleaning in electronics production process","authors":"M. Bursik, I. Szendiuch, V. Sítko","doi":"10.1109/ISSE.2009.5207064","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207064","url":null,"abstract":"Cleaning processes used in electronics productions are limited by cleaning efficiency. Those according to physical principle particular cleaning processes limits the area of application of existing system. At the selection of cleaning equipment is very important specification of their efficiency. For this purpose we have developed the quantifiable analyze of contaminated patterns. Evaluating is realized by test pattern on which are applied cleaning processes with different parameters. Next operation is visual controlling of residual contamination. In this way we are capable to determinate the average efficiency of cleaning system, specific efficiency on concrete test pattern and the homogeneity of cleaning efficiency in cleaning chamber. Important for cleaning process is an activity of cleaning medium. The activity of cleaning medium must be over minimum limits. Time intervals are set constant by the parameters of cleaning process especially its activity. For this reason is useful online monitoring of cleaning medium efficiency. This method requires universal sensor of medium activity.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115173363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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