Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging

Results on 3D Pixel Sensors for the CMS Upgrade at the HL-LHC HL-LHC CMS升级的三维像素传感器研究结果

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0046

R. Ceccarelli

{"title":"Results on 3D Pixel Sensors for the CMS Upgrade at the HL-LHC","authors":"R. Ceccarelli","doi":"10.22323/1.420.0046","DOIUrl":"https://doi.org/10.22323/1.420.0046","url":null,"abstract":"The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high-radiation tolerant silicon pixel sensors, capable of withstanding, in the innermost tracker layer of the CMS experiment, ﬂuences up to 1 . 5 × 10 16 n eq cm − 2 (1 MeV equivalent neutrons) before being replaced. An extensive R&D program aiming at 3D pixel sensors, built with a top-side only process, has been put in place in CMS in collaboration with FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The basic 3D cell size has an area of 25 × 100 µm 2 and is connected to a readout chip through a single, central electrode. A number of sensors were interconnected with the CMS pixel ReadOut Chip (CROC): built in 65 nm technology, the chip will be used in the pixel tracker of the CMS experiment during HL-LHC operations. In this paper the ﬁrst test beam results of irradiated 3D CROC modules are reported. The analysis of collected data shows excellent performance and hit detection eﬃciencies close to 99% measured after a ﬂuence of 1 × 10 16 n eq cm − 2 while meeting the noise occupancy requirements of the innermost tracker layer.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127320087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

MoTIC: Prototype of a Monolithic Particle Tracking Detector with Timing MoTIC:带定时的单片粒子跟踪检测器的原型

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0017

Stephan Tobias Burkhalter, L. Caminada, A. Ebrahimi, W. Erdmann, H. Kästli, B. Meier, B. Ristic, T. Rohe, R. Wallny

引用次数: 0

TROPIX: A Fast Parametric Tool Reproducing the Output of Pixel Detectors TROPIX:一个快速的参数化工具再现像素检测器的输出

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0090

A. Di Luca, F. Follega, E. Ricci, R. Iuppa

引用次数: 1

The ALICE Pixel Readout Upgrade ALICE像素读出升级

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0027

V. Sarritzu

引用次数: 1

ATLASPIX3 Modules for Experiments at Electron-Positron Colliders 正负电子对撞机实验用ATLASPIX3模块

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0086

R. Zanzottera, A. Andreazza, F. Sabatini, F. Palla, F. Bosi, A. Petri, A. Carbone, L. Meng, H. Fox, I. Perić, R. Schimassek, R. Dong, Y. Gao, J. Velthuis, J. Dopke, F. Wilson, D. Muenstermann, Y. Li, X. Xu, T. Jones

引用次数: 0

Optimization of a 65 nm CMOS Imaging Technology for Monolithic Sensors in High Energy Physics 高能物理中单片传感器65纳米CMOS成像技术的优化

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0083

W. Snoeys, G. Aglieri Rinella, A. Andronic, M. Antonelli, R. Baccomi, R. Ballabriga Sune, M. Barbero, P. Barrillon, J. Baudot, P. Becht, F. Benotto, S. Beole, G. Bertolone, A. Besson, W. Białas, G. Borghello, J. Braach, M. Buckland, S. Bugiel, E. Buschmann, P. Camerini, M. Campbell, F. Carnesecchi, L. Cecconi, E. Charbon, Ankur Chauhan, C. Colledani, G. Contin, D. Dannheim, K. Dort, João Pacheco de Melo, W. Deng, G. de Robertis, A. Di Mauro, A. Dorda Martin, A. Dorokhov, P. Dorosz, G. Eberwein, Z. El Bitar, X. Fang, A. Fenigstein, C. Ferrero, D. Fougeron, D. Gajanana, M. Goffe, L. Gonella, A. Grelli, V. Gromov, Alexandre Habib, Adi Haim, K. Hansen, J. Hasenbichler, H. Hillemanns, G. Hong, Ch. Hu, A. Isakov, K. Jaaskelainen, A. Junique, A. Kotliarov, I. Kremastiotis, F. Krizek, A. Kluge, R. Kluit, G. Kucharska, T. Kugathasan, Y. Kwon, P. La Rocca, L. Lautner, Pedro V. Leitão, B. Lim, F. Loddo, M. Mager, D. Marras, P. Martinengo, S. Masciocchi, Soniya Mathew, M. Menzel, F. Morel, B. Mulyanto, M. Münker, L.

引用次数: 1

Alternative Approach to Front-end Amplifiers Design for Timing Measurement with Silicon Pixel Detectors 硅像素探测器时序测量前端放大器设计的替代方法

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0049

M. Menichelli

{"title":"Alternative Approach to Front-end Amplifiers Design for Timing Measurement with Silicon Pixel Detectors","authors":"M. Menichelli","doi":"10.22323/1.420.0049","DOIUrl":"https://doi.org/10.22323/1.420.0049","url":null,"abstract":"The increase in luminosity and pileup foreseen for future colliders has recently pushed central pixel detector technology towards an increase in timing resolution. Increased time resolution can ease track reconstruction by adding a more precise timestamp to events for better track separation. An alternative approach to timing with silicon pixel detectors is proposed in this paper. Current approaches are based either on amplitude increase due to avalanche charge multiplication or in the reduction of charge collection time in a 3D geometry detector. Both approaches uses charge integration amplifiers for signal pre-amplification. The main feature of the proposed approach is based on current preamplifier signal readout and a more comprehensive approach to time resolution improvement. An additional aspect of this approach is that it shifts the attention from the detector design to the readout electronics design. The current pulse of a silicon detector has an intrinsically fast (in the order of 5 ps) rise-time however the actual rise-time of a detector connected to a current (low impedance) preamplifier is limited by the RC product of the input resistance and the capacitance of the detector/preamplifier interface and the bandwidth of the preamplifier itself; using low impedance amplifier and low capacitance pixel detector the rise-time of this pulse can be kept below 200 ps. The amplitude of the signal can be increased by bias overvoltage and temperature reduction (increases mobility shrinking the current pulse duration). Furthermore low temperature operation (- 30 °C or less) and the low input capacitance of the detector can help to reduce noise. The combination of reduced rise-time, increased amplitude and reduced noise can tentatively improve the overall time resolution below 20 ps which is considered the best result achieved.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125503291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Status of the CMS pixel detector CMS像素检测器的状态

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0008

V. Veszpremi

{"title":"Status of the CMS pixel detector","authors":"V. Veszpremi","doi":"10.22323/1.420.0008","DOIUrl":"https://doi.org/10.22323/1.420.0008","url":null,"abstract":"The tracking detector of the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC) is an all-silicon device. It is comprised of two sub-detectors. The pixel detector is the inner one, which is surrounded by the strip detector. The pixel detector provides seeds for charged particle tracking and measures the impact parameter of the reconstructed tracks. The impact parameter is essential in the reconstruction of primary interaction and secondary decay vertices. The pixel detector was upgraded in the beginning of 2017, during Run 2 of the LHC. Various interventions have been performed on the detector since then, the latest refurbishment taking place during Long Shutdown 2 (LS2) between 2019 and 2022, right after Run 2. The expected ﬂuence in the innermost layer reaches the expected limit for the sensors after about 250 fb − 1 of integrated luminosity; therefore, this layer was also scheduled to be replaced during LS2. In this paper, we describe the successful refurbishment and recommissioning program and the following relatively smooth data-taking period in the ﬁrst year of Run 3. Preliminary studies of the performance will be presented along with the veriﬁcation of the new layer 1 modules in which several weaknesses that were revealed during Run 2 have been ﬁxed.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131959043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Tracker alignment in CMS: interplay with pixel local reconstruction CMS中的跟踪器对齐:与像素局部重建相互作用

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0079

A. V. Barroso

{"title":"Tracker alignment in CMS: interplay with pixel local reconstruction","authors":"A. V. Barroso","doi":"10.22323/1.420.0079","DOIUrl":"https://doi.org/10.22323/1.420.0079","url":null,"abstract":"The CMS silicon tracking system measures the trajectories of charged particles with a hit resolution of the order of microns in the pixel detector and tens of microns in the strip detector. One of the most important inputs for track reconstruction is the precision with which the tracker geometry is known. Therefore the position, orientation, and curvature of each tracker sensor must be precisely determined. Changes in the operating conditions can cause movements in the different substructures and also in the sensors. For maintaining the targeted precision, frequent corrections are needed, and the procedure to determine these corrections is commonly referred to as tracker alignment. Due to accumulated radiation during data taking, the response of the sensors changes over time. This affects the local reconstruction of pixel hits and consequently the result of the alignment procedure. In this contribution, the alignment procedure in CMS is introduced, as well as the dedicated calibration for the pixel local reconstruction. The effect of the change in the local reconstruction due to aging of the sensors on the alignment procedure is discussed.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121653818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of the BCM' System for Beam Abort and Luminosity Monitoring at the HL-LHC HL-LHC束流中止与光度监测BCM系统的研制

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI: 10.22323/1.420.0040

A. Gorišek

引用次数: 0

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)最新文献