Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)最新文献

{"title":"Large area hybrid detectors at Sirius: Operation threshold optimization for Medipix3RX","authors":"Matheus Gimenez Fernandes, R. B. Campanelli, Gustavo Siqueira Gomes, J. Polli, E.B. Antonio","doi":"10.22323/1.420.0066","DOIUrl":"https://doi.org/10.22323/1.420.0066","url":null,"abstract":"At the Sirius synchrotron facility, large area photon counting detector systems are employed in different beamlines and experimental techniques. These detectors were developed at the Brazilian Synchrotron Light Laboratory (LNLS), the called PIMEGA series detectors feature Medipix3RX Application Specific Integrated Circuit (ASIC), with 256 x 256 squared pixels and 55 µ m pitch. In this work, the influence of the threshold energy level was evaluated in order to achieve optimized values for minimizing false counts during operation, which arise from the charge sharing effect. As a result, we have defined the Approximated Mean Multiplicity (AMM), which can be used as a new procedure in photon counting detectors to define an optimal operation threshold level. Additionally, energy calibrations and energy resolution experiments are presented, as well as the AMM values for multiple operation bias voltages and incident energies.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"264 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115234308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Status of the LHCb Pixel Detector","authors":"E. Lemos Cid","doi":"10.22323/1.420.0009","DOIUrl":"https://doi.org/10.22323/1.420.0009","url":null,"abstract":"The LHCb experiment at CERN is a general-purpose forward spectrometer at LHC (CERN) optimized for heavy flavour physics and rare decays. It provides a coverage of 2 < 𝜂 < 5 with a momentum resolution of 0.5 % at pT < 20 GeV. A data-set of 10 fb − 1 has been collected at the end of Run 2, followed by a major detector upgrade (Upgrade I), fully replacing the vertex and trigger subsystems [1]. The Vertex Locator (VELO) is a silicon pixel tracking detector in the heart of the LHCb spectrometer. As a higher instantaneous luminosity of 2 ∗ 10 33 𝑠 − 1 𝑐𝑚 − 2 is expected during Run 3 (2022 - 2025), the VELO has been upgraded by a brand-new detector. This new VELO replaces the silicon-strip technology with new 55 micrometers pitch pixels, operating as close as a 5 mm radius from the LHC beams. The VELO new readout ASIC, called VeloPix, is capable of operating at the 40 MHz collision rate, reaching 900 MHits/s. The detector is built with a modular design, composed of 52 modules divided into two-detector halves. The production of the required modules was completed in 2021, leading to the detector assembly phase. Both detector halves were successfully installed in May 2022. In this paper, the final steps of construction and installation will be shown. The detector is now under commissioning with beam and preliminary results will also be presented.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"12 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120858036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"ATLAS ITk Pixel Pre-production Planar Sensor Characterisation for the HL-LHC Upgrade","authors":"Yusong Tian, G. Calderini, I. Camp, Thibaud Idriss Carcone, P. Chabrillat, Artur Cordeiro Oudot Choi, F. Crescioli, J. Grosse-Knetter, S. Hadzic, Shunsuke Iizaka, Christopher Krause, L. Meng, K. Nakamura, A. Quadt, S. Terzo, Ana Sofia Torrento Coello, H. Ye","doi":"10.22323/1.420.0067","DOIUrl":"https://doi.org/10.22323/1.420.0067","url":null,"abstract":"Yusong Tian,a,∗ Giovanni Calderini, Imogen Camp, Thibaud Idriss Carcone, Paul Mickael Chabrillat, Artur Cordeiro Oudot Choi, Francesco Crescioli, Jörn Große-Knetter, Šejla Hadžić, Shunsuke Iizaka, Christopher Krause, Lingxin Meng, f Koji Nakamura, Arnulf Quadt, Stefano Terzo, Ana Sofia Torrento Coello and Hua Ye II. Physikalisches Institut, Georg-August-Universität Göttingen, Friedrich-Hund-Platz 1, DE 37077 Göttingen, Germany LPNHE, Sorbonne Université, Université Paris Cité, CNRS/IN2P3, 4 place Jussieu, FR 75005 Paris, France Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, DE 80805 München, Germany Division of Physics and Tomonaga Center for the History of the Universe, Faculty of Pure and Applied Sciences, University of Tsukuba, 1 Chome-1-1 Tennodai, Tsukuba, Japan Fakultät Physik, Technische Universität Dortmund, Otto-Hahn-Straße 4, DE 44227 Dortmund, Germany f Physics Department, Lancaster University, Bailrigg, Lancaster LA1 4YW, United Kingdom KEK, High Energy Accelerator Research Organization, 1-1 Oho, Tsukuba, Japan Institut de Física d’Altes Energies (IFAE), Barcelona Institute of Science and Technology, UAB Campus, Edifici CN, ES 08193 Barcelona, Spain Detectors and Instrumentation Department, IJCLab – Laboratoire de Physique des 2 Infinis Irène Joliot-Curie, UMR 9012 – CNRS / Université Paris-Saclay / Université Paris Cité, 15 rue Georges Clémenceau, FR 91405 Orsay, France","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131064264","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"ATLAS ITk Pixel Module Bump Bond Stress Analysis","authors":"J. Grosse-Knetter","doi":"10.22323/1.420.0056","DOIUrl":"https://doi.org/10.22323/1.420.0056","url":null,"abstract":"The upgrade of ATLAS for the high-luminosity LHC (HL-LHC) will among many detector components replace the tracking detector with an all-silicon tracker (ITk). The outer layers are composed of strip modules while the innermost 5 layers of ITk are composed of hybrid pixel modules mounted on carbon local supports. The large temperature ranges during operation and the heterogeneous nature of the system means that thermally induced stress is present in the module bump bonds. This paper presents a model using finite element analysis of the pixel module to estimate the maximum stress in the bump bonds. Experimental results are shown of bump strength from lap-shear measurements. Finally, detailed module characterisation is presented of module bump failure due to thermal cycling. Bump bonds are demonstrated to survive 100 cycles over the design thermal cycling range with less than 0.1% thermally induced bump bond disconnects.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133953713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"MVTX: A MAPS Vertex Tracker for sPHENIX at RHIC","authors":"Ho-San Ko","doi":"10.22323/1.420.0073","DOIUrl":"https://doi.org/10.22323/1.420.0073","url":null,"abstract":"We assembled a MAPS (Monolithic Active Pixel Sensor) vertex tracker, MVTX, with 0 . 19 m 2 total silicon coverage and a pixel pitch of 27 µ m. 48 staves, each comprised of 9 sensors thinned down to 50 µ m thickness, are supported by carbon composite structures and organized into three concentric layers immediately surrounding the beampipe inside of the sPHENIX at RHIC of BNL. Reaching the designed resolution of MVTX is critical to the delivery of sPHENIX physics including heavy flavor studies. We present the construction and ∼ 20 µ m-level mechanical alignment in the carbon composite support structure.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128417234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Status of the ATLAS Pixel Detector","authors":"M. Battaglia","doi":"10.22323/1.420.0006","DOIUrl":"https://doi.org/10.22323/1.420.0006","url":null,"abstract":"","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133317666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Pixel detectors using single energetic quantum imaging: Past and future","authors":"E. Heijne","doi":"10.22323/1.420.0003","DOIUrl":"https://doi.org/10.22323/1.420.0003","url":null,"abstract":"The early steps with 2-dimensional semiconductor detectors for particle physics experiments are briefly described. A comparison is made between monolithic devices, especially the CCD, and hybrid detectors, which combine a semiconductor sensor matrix with a separate ASIC in advanced CMOS technology. There is only a fragmentary treatment of the exploitation of the pixelated silicon systems in the LHC experiments, although these have become essential for tracking and vertexing in the high particle density in LHC. Some applications in other fields are mentioned. The difference is pointed out between the single quantum processing in these imagers, and the usual imagers for visible radiation. A few thoughts are developed in view of future pixel detector developments.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":" 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120831179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental Study and Empirical Modeling of Long Term Annealing of the ATLAS18 Sensors","authors":"R. Orr","doi":"10.22323/1.420.0043","DOIUrl":"https://doi.org/10.22323/1.420.0043","url":null,"abstract":"","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122024744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Monitoring Quality of ATLAS ITk Strip Sensors Through Database","authors":"V. Fadeyev, M. Beranek, Eric Bach, M. Basso, A. Blue, P. Federicova, J. Fernandez-Tejero, A. Fournier, G. Greig, Derek Hamersly, K. Hara, E. Hill, S. Hirose, B. Hommels, D. Jones, C. Klein, T. Koffas, V. Latonova, M. Mikestikova, K. Nakamura, L. Poley, R. Orr, D. Rousso, B. Stelzer, M. Sykora, M. Ullán, Y. Unno","doi":"10.22323/1.420.0058","DOIUrl":"https://doi.org/10.22323/1.420.0058","url":null,"abstract":"The High-Luminosity LHC upgrade necessitates a complete replacement of the ATLAS Inner Detector with a larger all-silicon tracker. The strip portion of it covers 165 m 2 area, afforded by the strip sensors. Following several prototype iterations and a successful pre-production, a full-scale production started in 2021, to finish in 2025. It will include about 21,000 wafers and a factor of 5 higher throughput than pre-production, with about 500 sensors produced and tested per month. The transition to production stressed the need to evaluate the results from the Quality Control (QC) and Quality Assurance (QA) tests quickly to meet the monthly delivery schedule. The test data come from 15 collaborating institutes, therefore a highly distributed system with standardized interfaces was required. Specialized software layers of QA and QC Python code were developed against the backend of the ITk database (DB) for this purpose. The developments included particularities and special needs of the Strip Sensors community, such as the large variety of different test devices and test types, the necessary test formats, and different workflows at the test sites. Special attention was paid to techniques facilitating the development and user operations, for example creation of “parallel” sets of dummy DB objects for practice purposes, iterative verification of operability, and the automatic upload of test data. The scalability concerns and automation of the data handling were included in the system architecture from the very inception. The full suite of functionalities includes data integrity checks, data processing to extract and evaluate key parameters, cross-test comparisons, and summary reporting for continuous monitoring. We will also describe the lessons learned and the necessary evolution of the system.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123576983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Status of the BELLE II Pixel Detector","authors":"G. Giakoustidis, F. Abudinén, K. Ackermann, P. Ahlburg, M. Albalawi, O. Alonso, L. Andricek, R. Ayad, Varghese Babu, Anselm Baur, F. Bernlochner, T. Bilka, A. Bolz, A. Bozek, C. Camien, A. C. Caldwell, L. Cao, V. Chekelian, Á. Diéguez, J. Dingfelder, Z. Doležal, M. Fras, A. Frey, M. Gabriel, K. Gadow, T. Gessler, D. Getzkow, L. L. Gioi, D. Greenwald, M. Heck, M. Hensel, M. Hoek, Stefan Huber, J. Kandra, P. Kapusta, R. Karl, Jasper Kehl, C. Kiesling, B. Kisielewski, D. Kittlinger, D. Klose, P. Kodyš, C. Koffmane, I. Konorov, Matthäus Krein, S. Krivokuca, T. Kuhr, S. Kurz, P. Kvasnička, J. S. Lange, K. Lautenbach, U. Leis, P. Leitl, D. Levit, G. Liemann, Qingyuan Liu, Zhen’An Liu, T. Lück, C. Marinas, S. Mccarney, H. Moser, D. Moya, F. Müller, F. Müller, C. Niebuhr, J. Ninkovic, B. Paschen, S. Paul, I. Perić, D. Pitzl, A. Rabusov, Markus Reif, S. Reiter, Rainer Richter, M. Ritter, M. Ritzert, J. Sanchez, B. Scavino, G. Schaller, J. Schmitz, M. Schnecke, F. Schopper, H. Schreeck, B. Schwenker, M. Schwickardi","doi":"10.22323/1.420.0005","DOIUrl":"https://doi.org/10.22323/1.420.0005","url":null,"abstract":"The Belle II experiment at the Super KEK B-factory (SuperKEKB) in Tsukuba, Japan, has been collecting 𝑒 + 𝑒 − collision data since March 2019. Operating at a record-breaking luminosity of up to 4 . 7 × 10 34 cm − 2 s − 1 , data corresponding to 424 fb − 1 has since been recorded. The Belle II Vertex Detector (VXD) is central to the Belle II detector and its physics program and plays a crucial role in reconstructing precise primary and decay vertices. It consists of the outer four-layer Silicon Vertex Detector (SVD) using double-sided silicon strips and the inner two-layer PiXel Detector (PXD) based on the Depleted P-channel Field Effect Transistor (DePFET) technology. The PXD DePFET structure combines signal generation and amplification within the pixels with a minimum pitch of ( 50 × 55 ) µ m 2 . A high gain and a high Signal-to-Noise Ratio (SNR) allow thinning the pixels to 75 µ m while retaining a high pixel hit efficiency of about 99 % for the Belle II","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128655582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}