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IEEE International Conference on 3D System Integration最新文献

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Invited talk: Some challenges in scaling 3D ICs to a broader application set 特邀演讲:将3D集成电路扩展到更广泛应用的一些挑战
IEEE International Conference on 3D System Integration Pub Date : 2015-11-23 DOI: 10.1109/3DIC.2015.7334470
S. Iyer
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引用次数: 0
Invited talk: Progress in 3D integrated circuits 特邀演讲:3D集成电路的进展
IEEE International Conference on 3D System Integration Pub Date : 2015-11-23 DOI: 10.1109/3DIC.2015.7334554
R. Patti
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引用次数: 0
Invited talk: Technology and overview of Sony's 3D stacked CMOS image sensor 特邀演讲:索尼3D堆叠CMOS图像传感器技术与概述
IEEE International Conference on 3D System Integration Pub Date : 2015-11-23 DOI: 10.1109/3DIC.2015.7334561
T. Ogita
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引用次数: 0
Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections 通过控制三维连接件的结构和力学性能实现三维连接件局部残余应力的最小化
IEEE International Conference on 3D System Integration Pub Date : 2012-08-16 DOI: 10.1109/3DIC.2012.6262997
K. Nakahira, F. Endo, R. Furuya, Ken Suzuki, H. Miura
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引用次数: 1
3D multiprocessor with 3D NoC architecture based on Tezzaron technology 基于Tezzaron技术的3D NoC架构的3D多处理器
IEEE International Conference on 3D System Integration Pub Date : 1900-01-01 DOI: 10.1109/3DIC.2012.6263027
M. H. Jabbar, D. Houzet, O. Hammami
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引用次数: 1
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