International Symposium on Laser Metrology最新文献_第2页

Three-dimensional profile measurement using a flexible new multiview connection method 三维轮廓测量采用灵活的新多视图连接方法

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814619

Peng Zheng, Hongwei Guo, Yingjie Yu, Mingyi Chen

引用次数: 7

Surface measurement with Shack-Hartmann wavefront sensing technology 利用Shack-Hartmann波前传感技术进行表面测量

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814541

X. Li, L. Zhao, Z. Fang, A. Asundi, X. M. Yin

{"title":"Surface measurement with Shack-Hartmann wavefront sensing technology","authors":"X. Li, L. Zhao, Z. Fang, A. Asundi, X. M. Yin","doi":"10.1117/12.814541","DOIUrl":"https://doi.org/10.1117/12.814541","url":null,"abstract":"When wavefront is reflected by a surface, the information of the surface profile is carried by the reflected wavefront. Measure the wavefront can extract the profile information. There are different kinds of pre-defined surface profile with various dimensions. While the size of particular wavefront sensor is fixed, the measurement range is limited. The design of optical system to bridge the work piece and wavefront sensor is critical. This paper presents a platform for the guidance of optical system design. The parameters of commercial available optical components are input to the platforms and the propagation of reflected wavefront is simulated. The relationship of part profile and the measurement wavefront is provided. The discussion is focused on the 2f+2f system for surface flatness measurement. The measurement of aspherical surface is also presented. Shack-Hartmann wavefront sensor (SHWS) is selected due to its simple structure, insensitivity to vibration etc, which is suitable for in-line application. Optical system is designed with the guidance of simulation platform. The experimental results shows the 2f+2f system is compatible to misalignments, can be used to monitor the deformations of parts. The measurement of aspherical surface is also presented with the comparison of simulation results.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"246 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132750636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Characterisation of laser marks using digital holographic microscopy 用数字全息显微镜表征激光标记

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814729

V. Singh, O. Chee, Eddy Sim, A. Asundi

引用次数: 3

Determination of flatness on patterned wafer surfaces using wavefront sensing methods 用波前传感法测定图案晶圆片表面的平整度

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814535

A. Nutsch, L. Pfitzner, T. Grandin, X. Levecq, S. Bucourt

{"title":"Determination of flatness on patterned wafer surfaces using wavefront sensing methods","authors":"A. Nutsch, L. Pfitzner, T. Grandin, X. Levecq, S. Bucourt","doi":"10.1117/12.814535","DOIUrl":"https://doi.org/10.1117/12.814535","url":null,"abstract":"New lithography technologies, as for example Extreme Ultra Violet (EUV), require high flatness on the exposure surfaces as the depth of focus is impacted. It is essential for semiconductor manufacturing to measure and control flatness of wafer surfaces at nanometer scale. In-plane geometrical defects on wafer surfaces following Chemical Mechanical Planarization (CMP) processing in the lateral millimeter range and in vertical dimensions in the nanometer range are of increasing importance. They will become a severe yield limiting factor in the 32 nm generations and below. This paper shows the result from improvement and optimization of metrology using wavefront sensing methods according to Makyoh and Shack Hartmann. Magnification and increased density of measurement points were identified to improve the existing performance with respect to vertical resolution significantly below 100 nm. The achieved lateral resolution on the wafer surface was 750 μm. The accuracy of the measurement on patterned wafer surfaces was determined to be less than 15 nm. The accuracy was determined by repeating the topography measurement and filtering of the according data of the sensors using cross section analysis and spatial processing with double Gaussian filters. The samples were taken from different manufacturing steps, such as Shallow Trench Isolation (STI) and interconnect metallization. Wavefront sensing based on methods according to Makyoh and Shack Hartmann enabled instantaneous and non-destructive flatness measurement of surfaces.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131903664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

A multipoint diffraction strain sensor using micro-lens array: review on variable sensitivity 微透镜阵列多点衍射应变传感器:变灵敏度研究进展

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814564

J. Wang, A. Asundi

引用次数: 0

Phase shift polarimetry for non-invasive detection of laser-induced damage 相移偏振法无创检测激光损伤

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814537

Pin Wang, A. Asundi

引用次数: 4

Precision optical metrology for MEMSm MEMSm精密光学测量

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814565

R. Pryputniewicz

引用次数: 0

Modeling of coupling coefficient as a function of coupling ratio 耦合系数作为耦合比函数的建模

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814562

.. Saktioto, J. Ali, M. Fadhali, R. A. Rahman, J. Zainal

引用次数: 10

Inspection method for directional texture defects on steel strip surface 钢带表面定向织构缺陷的检测方法

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814524

J. Cong, Y. Yan

引用次数: 1

Active alignment and reliable pigtailing of laser diode transmitter 激光二极管发射机的主动对准与可靠配尾

International Symposium on Laser Metrology Pub Date : 2008-10-03 DOI: 10.1117/12.814574

M. Fadhali, .. Saktioto, J. Zainal, Y. Munajat, J. Ali, R. Rahman

{"title":"Active alignment and reliable pigtailing of laser diode transmitter","authors":"M. Fadhali, .. Saktioto, J. Zainal, Y. Munajat, J. Ali, R. Rahman","doi":"10.1117/12.814574","DOIUrl":"https://doi.org/10.1117/12.814574","url":null,"abstract":"In this paper we present theoretical and experimental analysis on Nd:YAG laser microwelding for pigtailing laser diode transmitter through two ball lenses that are employed for effectively matching the elliptical mode field of the laser diode with the circular on of the single mode fiber. The fiber attachment and the fixing of various coupling components have been performed in what is so called active alignment process. The system continues measuring the coupled power during the processes of alignment and attachment of various coupling components as well as the working distance and misalignment tolerances optimizations. Results of theoretical modeling of laser weld penetration depth agree with the experimentally measured results in the low laser pulse energy range. Moreover the laser pulse parameters such as, duration, energy, number of pulse shoots as well as the focusing position over the workpiece and angle of laser pulse incidence are found to have very significant effects on the weld yields and greatly affect the laser weld depth to width ratio. Optimization of all the mentioned parameters found to be necessary for achieving strong laser microwelds with more penetration and less width in the attachments of the sensitive optical components inside the packaged photonic devices modules.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128413150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0