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Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.最新文献

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Characterizations of interconnects formed in electromagnetic bandgap substrates 电磁带隙衬底中形成的互连特性
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500903
A. Suntives, R. Abhari
{"title":"Characterizations of interconnects formed in electromagnetic bandgap substrates","authors":"A. Suntives, R. Abhari","doi":"10.1109/SPI.2005.1500903","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500903","url":null,"abstract":"In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"286 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115330006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A passivity checking algorithm for delay-based macromodels of lossy transmission lines 一种基于时延的有损传输线宏观模型无源检测算法
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500920
E. Gad, Changzong Chen, M. Nakhla, R. Achar
{"title":"A passivity checking algorithm for delay-based macromodels of lossy transmission lines","authors":"E. Gad, Changzong Chen, M. Nakhla, R. Achar","doi":"10.1109/SPI.2005.1500920","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500920","url":null,"abstract":"This paper presents a new algorithm for verifying passivity in macromodels of lossy multiconductor interconnects. The macromodels considered in this paper are constructed from the method of characteristics and include delay element. The new algorithm is derived from the results of a new theory that describes the necessary and sufficient conditions of positive-realness in dynamical system described by delay differential equations.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117062351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
De-embedding methods for characterizing PCB interconnections 表征PCB互连的去嵌入方法
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500899
V. Ricchiuti, A. Orlandi, G. Antonini
{"title":"De-embedding methods for characterizing PCB interconnections","authors":"V. Ricchiuti, A. Orlandi, G. Antonini","doi":"10.1109/SPI.2005.1500899","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500899","url":null,"abstract":"When the bit rate of the digital signals exchanged between PCBs are in the gigabit per second range, the electrical characteristics of the PCB traces can alter the signal propagation. Consequently, the designer has to evaluate accurately the electrical behavior of PCB interconnects used for transmitting high speed digital signals. Measurements can be carried out on PCB traces usually connected to the measurement instrument using some kind of transition network or fixture (e.g. SMA connectors). To de-embed the effects of these fixtures, so to evaluate the electrical behavior of the only used traces, the paper proposes three simple methods in the frequency domain.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115158472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Time domain reduced order macromodel for interconnects excited by incident fields 入射场激励下互连的时域降阶宏模型
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500943
T. S. Roseanu, M. Ma, R. Khazaka, P. Gunupudi
{"title":"Time domain reduced order macromodel for interconnects excited by incident fields","authors":"T. S. Roseanu, M. Ma, R. Khazaka, P. Gunupudi","doi":"10.1109/SPI.2005.1500943","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500943","url":null,"abstract":"This paper presents an algorithm for reduced order macromodeling of high speed interconnects excited by incident electromagnetic fields. The reduced order macromodel has the form of a passive reduced order network with Norton equivalent sources at the ports representing the incident fields. A projection based order reduction method is presented to efficiently evaluate the Norton equivalent sources and Krylov subspace methods are used to obtain the passive reduced order network. The resulting macromodel is typically an order of magnitude smaller than the original one and can be simulated in standard time domain simulators such as SPICE.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116913042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
LIM-SPICE for the analysis of power distribution networks 用于配电网分析的LIM-SPICE
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500882
Z. Deng, J. Schutt-Ainé
{"title":"LIM-SPICE for the analysis of power distribution networks","authors":"Z. Deng, J. Schutt-Ainé","doi":"10.1109/SPI.2005.1500882","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500882","url":null,"abstract":"This paper presents the implementation of a new LIM-SPICE simulator. The latency insertion method (LIM) is improved and integrated into SPICE as an accelerating option. Since LIM has linear computational complexity and is substantially faster than SPICE, the new LIM-SPICE simulator can simulate large linear networks with substantially higher speed within the SPICE simulation framework. In addition, mutual inductance between branches are handled by utilizing a K matrix formulation.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134045069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
An approach to model board-integrated multimode waveguides 板集成多模波导的建模方法
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500904
K. Halbe, E. Griese
{"title":"An approach to model board-integrated multimode waveguides","authors":"K. Halbe, E. Griese","doi":"10.1109/SPI.2005.1500904","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500904","url":null,"abstract":"Signal propagation within multimode waveguides with rectangular cross sections is modeled by an approximative determination of the propagating modes. Precondition for the approach is a small difference between the refractive indices of the waveguide's core and cladding leading to a small numerical aperture. The approximation yields good results for modes far away from cutoff. As the roughness between core and cladding of real board-integrated waveguides results in a stronger attenuation of the higher order modes compared to the modes of lower order, the approximation seems to be well suited for modeling this kind of waveguides.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132544077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Mutual coupling in interconnect lines: analysis using finite difference time domain method 互连线路的相互耦合:时域有限差分法分析
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500883
N. Farahat, R. Mittra, J. Agosto
{"title":"Mutual coupling in interconnect lines: analysis using finite difference time domain method","authors":"N. Farahat, R. Mittra, J. Agosto","doi":"10.1109/SPI.2005.1500883","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500883","url":null,"abstract":"In this paper, we present a simple technique for analyzing the mutual coupling effects in interconnects using the finite difference time domain (FDTD) method. The interconnect lines are divided into a set of uniform segments of parallel lines with short lengths. Next, the mutual capacitances and inductances of each of these segments are extracted by incorporating the FDTD solution into the telegrapher's equations. Two examples of coplanar lines and microstrip lines on different dielectric substrates are studied.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129092736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SPI proceedings: model of nonhomogenous multilayer structures in frequency domain 非均匀多层结构的频域模型
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500933
J. Braun, Z. Žilka, Z. Berka
{"title":"SPI proceedings: model of nonhomogenous multilayer structures in frequency domain","authors":"J. Braun, Z. Žilka, Z. Berka","doi":"10.1109/SPI.2005.1500933","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500933","url":null,"abstract":"In this paper a sandwich multilayer structure as a model of a mixed-signal systems (digital and analog) interconnect is introduced. The method for analysis in frequency domain of such inhomogenous structure based on matrix functions is presented. The program AMVOLC for the analysis of printed circuit interconnect is described. With the described approach the more complicated structures may be analyzed as well.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"382 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128124192","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accurate broadband parameter extraction methodology for S-parameter measurements s参数测量的精确宽带参数提取方法
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500897
J. Balachandran, S. Brebels, G. Carchon, W. De Raedt, B. Nauwelaers, E. Beyne
{"title":"Accurate broadband parameter extraction methodology for S-parameter measurements","authors":"J. Balachandran, S. Brebels, G. Carchon, W. De Raedt, B. Nauwelaers, E. Beyne","doi":"10.1109/SPI.2005.1500897","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500897","url":null,"abstract":"GHz range operating frequencies of today's semiconductor devices demand accurate interconnect models. Constructing accurate and scalable models require extraction of interconnect parameters namely resistance-R, inductance-L, capacitance-C and conductance-G from measured S-parameters. The parameter extraction is error prone influenced by half-wavelength resonance. In this paper, we present a new methodology for accurately extracting interconnect parameters from measured S-parameters. We first analyze the parameter extraction errors and show that it can be mainly attributed to non-perfect de-embedding. Based on the error analysis, we derive an extraction flow for accurate interconnect characterization. The proposed method is validated with fabricated transmission line test structures. Extracted line parameters agree with well-known theoretical models, establishing accuracy of the method.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130002042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Low-loss contact pad with tuned impedance for operation at millimeter wave frequencies 低损耗接触垫与调谐阻抗操作在毫米波频率
Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI: 10.1109/SPI.2005.1500898
U. Pfeiffer
{"title":"Low-loss contact pad with tuned impedance for operation at millimeter wave frequencies","authors":"U. Pfeiffer","doi":"10.1109/SPI.2005.1500898","DOIUrl":"https://doi.org/10.1109/SPI.2005.1500898","url":null,"abstract":"In this paper an on-chip pad structure with minimized losses and matched impedance is presented. The pads use a metal ground-shield thereunder to minimize the influence from a lossy silicon substrate. A shunt transmission line stub is used to resonate the pad capacitance, thereby providing a matched impedance into a 50 /spl Omega/ on-chip transmission line. A second-tier calibration technique was used to extract their 2-port S-parameter characteristic. The measured performance is compared with simulations of standard pad structures up to 65 GHz.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130178149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
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