Research Progress of SiO2 Regrowth during Selective Etching Process in 3D NAND Manufacture Procedure

电化学 Pub Date : 2021-02-28 DOI:10.13208/J.ELECTROCHEM.200610

Zihan Zhou, Yunwen Wu, Ming Li, Su Wang

引用次数: 2

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三维NAND工艺中选择性蚀刻过程中SiO2再生的研究进展

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

电化学

CiteScore

2.90

自引率

0.00%

发文量

2423

期刊介绍： The journal "Electrochemistry (Chinese and English)" is an academic journal supervised by the China Association for Science and Technology, co-sponsored by the Chinese Chemical Society and Xiamen University, and co-sponsored by the State Key Laboratory of Physical Chemistry of Solid Surfaces of Xiamen University, Huizhou Yiwei Lithium Energy Co., Ltd., and the National Engineering Research Center for Electrochemical Energy Storage Technology. It is publicly distributed at home and abroad, aiming to timely reflect the latest scientific research results and trends in the field of electrochemistry in my country and promote academic exchanges at home and abroad. It has columns such as review, research papers, and research briefs.