Monolithic 3D (M3D) reconfigurable logic applications using extremely-low-power electron devices

2017 China Semiconductor Technology International Conference (CSTIC) Pub Date : 2017-03-01 DOI:10.1109/CSTIC.2017.7919753

W. Choi

引用次数: 0

Abstract

CMOS and nano-electromechanical (NEM) hybrid reconfigurable logic (RL) circuits are implemented by using monolithic three-dimensional (M3D) integration process. Their operation and feasibility are discussed based on simulation and experimental results.

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使用极低功耗电子器件的单片3D (M3D)可重构逻辑应用

采用单片三维(M3D)集成工艺实现了CMOS和纳米机电(NEM)混合可重构逻辑(RL)电路。根据仿真和实验结果，讨论了其可操作性和可行性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 China Semiconductor Technology International Conference (CSTIC)

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