发布求助
文献互助 智能选刊 最新文献

Microstructures and Flux Pinning Properties of BHO-doped SmBa 2 Cu 3 O y Thin Films on IBAD-MgO Substrates with Y 2 O 3 -doped Seed Layer

The transactions of the Institute of Electrical Engineers of Japan.A Pub Date : 2017-01-01 DOI:10.1541/ieejfms.137.298
Yutaro Watanabe, Y. Yoshida, Y. Ichino, A. Ibi, T. Izumi, T. Kato
{"title":"Microstructures and Flux Pinning Properties of BHO-doped SmBa 2 Cu 3 O y Thin Films on IBAD-MgO Substrates with Y 2 O 3 -doped Seed Layer","authors":"Yutaro Watanabe, Y. Yoshida, Y. Ichino, A. Ibi, T. Izumi, T. Kato","doi":"10.1541/ieejfms.137.298","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":23081,"journal":{"name":"The transactions of the Institute of Electrical Engineers of Japan.A","volume":"4 1","pages":"298-303"},"PeriodicalIF":0.0000,"publicationDate":"2017-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The transactions of the Institute of Electrical Engineers of Japan.A","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1541/ieejfms.137.298","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
分享
查看原文 本刊更多论文
掺杂y2o3种子层的bho掺杂smba2cu3oy薄膜在iad - mgo衬底上的微结构和通量钉钉性能
本文章由计算机程序翻译，如有差异，请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
The transactions of the Institute of Electrical Engineers of Japan.A
The transactions of the Institute of Electrical Engineers of Japan.A
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信