Detection tests of imaging devices based on silicon pixel-array detectors assembled using Tape Automated Bonding and microcable technologies

IEEE Nuclear Science Symposuim & Medical Imaging Conference Pub Date : 2010-10-01 DOI:10.1109/NSSMIC.2010.5874393

V. Borshchov, D. Burdette, E. Chesi, V. Cindro, N. Clinthorne, E. Cochran, B. Grošičar, K. Honscheid, H. Kagan, C. Lacasta, O. Listratenko, G. Llosá, M. Mikuž, M. Protsenko, V. Stankova, A. Studen, I. Tymchuk, P. Weilhammer, D. Žontar, V. Linhart

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Abstract

Detection and spectroscopic tests of three self-triggered silicon detection modules constructed using Tape Automated Bonding and micro-cable technologies and equipped by VATA read-out chips are presented and compared. Results of these tests are demonstrated using hit maps and pulse-height spectra induced by 133Ba, 241Am, and 57Co radioactive sources of X- and gamma rays. We have observed significant improvement in measurement of hit maps in the cases of first and second detector modules. The hit maps of the first detector module have proven that some problems occur in addressing certain VATA chip channels. Whereas, the hit maps of the second detector module is correct. On the other side, spectroscopic resolution given by the Full Width at Half Maximum (FWHM) of the first detection module is below 2 keV which is compatible with measurements on wire bonded modules. The FWHM of the second module is approximately two times worse.

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基于硅像素阵列探测器的成像设备检测测试，采用胶带自动粘合和微电缆技术组装

介绍并比较了三种采用胶带自动粘接和微电缆技术构建的、配备VATA读出芯片的自触发硅检测模块的检测和光谱测试。这些测试的结果用X射线和伽马射线的133Ba、241Am和57Co放射源诱导的命中图和脉冲高度谱来证明。我们观察到，在第一和第二检测器模块的情况下，命中图的测量有了显著的改进。第一个检测器模块的命中图已经证明在寻址某些VATA芯片通道时会出现一些问题。而第二个探测器模块的命中图是正确的。另一方面，第一个检测模块的半最大全宽(FWHM)给出的光谱分辨率低于2 keV，这与线键合模块的测量兼容。第二个模块的FWHM大约差两倍。

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IEEE Nuclear Science Symposuim & Medical Imaging Conference

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