Parallel-axis positioning device for laser processing: Design and applications

2009 Conference on Lasers & Electro Optics & The Pacific Rim Conference on Lasers and Electro-Optics Pub Date : 2009-10-30 DOI:10.1109/CLEOPR.2009.5292679

Yinzhou Yan, L. Ji, Yong Bao, Yi-jian Jiang

引用次数: 1

Abstract

A parallel-axis positioning device with “twice positioning” method is presented to exectly locate the laser spot at a special position on workpiece for laser macro-processing. Position accuracy of the laser spot on workpiece reaches 0.01mm.

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激光加工用平行轴定位装置:设计与应用

提出了一种采用“二次定位”方法的平行轴定位装置，可将激光光斑精确定位在工件上的特定位置进行激光宏加工。激光光斑在工件上的定位精度达到0.01mm。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2009 Conference on Lasers & Electro Optics & The Pacific Rim Conference on Lasers and Electro-Optics

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