Determining the Glass Transition Temperature of an Epoxy Siloxane Composite by Thermal Analysis Methods

Abstract

Thermomechanical analysis, dynamic mechanical analysis, differential scanning calorimetry, and dielectric thermal analysis were used to determine the glass transition temperature of hot-curing epoxy siloxane composites. The effect of polymethylphenylsiloxane resin on the parameters of the three-dimensional structure and on the deformation and strength properties of epoxy novolac resin during curing by 4,4′-diaminodiphenylmethane was established.