A study on the effect of bath composition on the internal stress of a palladium electrodeposit

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1998-01-01 DOI:10.1080/00202967.1998.11871233

Fang-Zu Yang, Shukai Xu, Ling Huang, Xueyuan Zhang, Sm Zhou

引用次数: 3

Abstract

SummaryThe effects of bath composition on the internal stress of palladium electrodeposits are studied in neutral media with Pd(NH3)2Cl2, K3C6H5O7, (NH4)2C2O4 and the additives of the mixture of the synthesized products of nicotinic acid and nicotiamide (NANA), pyridine-3-sulfonic acid(PSA), α-furane formic acid(FF) and cetyl trimethyl ammonium bromide(CTMAB). The results show that the internal stress of electrodeposits is quite changeable at the beginning of electrodeposition later becoming stable gradually. Deposits obtained from pulse electrodeposition have lower stress than that from direct current. After electrodeposition, all the deposits keep in tensile stress which increases with time.

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镀液成分对钯电镀层内应力影响的研究

摘要在中性介质中，以Pd(NH3)2Cl2、K3C6H5O7、(NH4)2C2O4以及烟酸和烟酰胺(NANA)、吡啶-3-磺酸(PSA)、α-呋喃甲酸(FF)和十六烷基三甲基溴化铵(CTMAB)等合成产物的混合物为添加剂，研究了镀液组成对钯电镀层内应力的影响。结果表明:在电沉积初期，沉积层的内应力变化较大，随后逐渐趋于稳定。脉冲电沉积得到的镀层比直流电沉积得到的镀层应力小。电沉积后，所有镀层都保持拉应力，并随时间增大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.