{"title":"Interconnecting and packaging VLSI chips","authors":"A. Mones, R. Spielberger","doi":"10.1016/0026-2714(84)90133-1","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":21779,"journal":{"name":"Solid State Technology","volume":"27 1","pages":"119-122"},"PeriodicalIF":0.0000,"publicationDate":"1984-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0026-2714(84)90133-1","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid State Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/0026-2714(84)90133-1","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Materials Science","Score":null,"Total":0}