Target polishing of KDP crystals by organic acid-ionic liquid-in-oil microemulsions

Q3 Materials Science
Hui Dong, Jinlong Pan, Shuke Huang, Pengfei Sun, Wei Gao
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引用次数: 2

Abstract

Chemical polishing is an effective method to remove a subsurface damage layer with the advantages of no mechanical stress and no new subsurface damage. In this paper, we report a target polishing method that employs an anhydrous organic acid-ionic liquid-in-oil (OA-IL/O) microemulsion as the etching solution for chemical polishing of KDP crystals. OA-IL/O microemulsions were prepared with 1-butyl-3-methyl imidazolium bis [(trifluoromethyl) sulfonyl] imide ([Bmim]TF2N) and bis (trifluoromethane sulfonimide) (TF2NH) as the internal phase, castor oil as the external phase, TX-100 as the surfactant, and n-butanol as the co-surfactant. TF2NH irreversibly reacts with KDP when microemulsion micelles driven by Brownian motion collide with the KDP surface. The organic salt products are removed by the ionic liquid in the microemulsion, resulting in the effective elimination of KDP. Moreover, the organic acid-ionic liquid solution will preferentially diffuse to the high points of the KDP surface and react with the KDP to achieve the target polishing. As a new type of water-free surface polishing technology, OA-IL/O microemulsion not only has the advantages of traditional CMP, but also avoids the recrystallization that can occur with water-in-oil microemulsions and achieves target polishing of the KDP crystal.

Abstract Image

油中有机酸离子液体微乳液对KDP晶体的靶向抛光
化学抛光是一种去除亚表面损伤层的有效方法,具有不产生机械应力和不产生新的亚表面损伤的优点。本文报道了一种采用无水有机酸离子油液(OA-IL/O)微乳液作为蚀刻液对KDP晶体进行化学抛光的靶抛光方法。以1-丁基-3-甲基咪唑双[(三氟甲基)磺酰]亚胺([Bmim]TF2N)和双(三氟甲烷磺酰亚胺)(TF2NH)为内相,蓖麻油为外相,TX-100为表面活性剂,正丁醇为助表面活性剂制备了OA-IL/O微乳。当微乳液胶束在布朗运动驱动下与KDP表面发生碰撞时,TF2NH与KDP发生不可逆反应。微乳液中的离子液体除去有机盐产物,有效地消除了KDP。此外,有机酸离子液体溶液会优先扩散到KDP表面的高点,并与KDP发生反应以达到目标抛光。OA-IL/O微乳液作为一种新型的无水表面抛光技术,既具有传统CMP的优点,又避免了油包水微乳液的重结晶现象,实现了对KDP晶体的目标抛光。
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来源期刊
JCIS open
JCIS open Physical and Theoretical Chemistry, Colloid and Surface Chemistry, Surfaces, Coatings and Films
CiteScore
4.10
自引率
0.00%
发文量
0
审稿时长
36 days
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