Measurement of Shielding Effectiveness in Coaxial Cables and Connectors With Various Dielectrics Using an Electric Field Probe

IF 3.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2025-04-02 DOI:10.1109/TDEI.2025.3557368

Kenedy Marconi G. Santos;Marcelo B. Perotoni;Elvio P. Silva;Amélia M. Santos;Marcela S. Novo;Tagleorge M. Silveira;Polyane A. Santos;Décio R. M. Faria;Ronaldo M. Lima;Leonardo S. Caires;Marcos R. Gallego;Sérgio M. O. Tavares;Rui A. S. Moreira

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引用次数: 0

Abstract

Ensuring proper shielding is essential for the electromagnetic compatibility of electronic devices and systems. This article investigates the shielding effectiveness (SE) of coaxial cables and connectors using an electric field probe (EFP). This study aims to identify shielding failures early to prevent costly fixes later. A method for measuring the electric field radiated by connectors and cables in both near-field and far-field conditions is presented. Additionally, an electromagnetic virtual model of the connector and cable is developed, incorporating the dimensions and properties of the dielectric material. The simulations focus on the impact of different dielectrics on the resonant frequency of the electric field, specifically common-mode energy. The results indicate that the dielectric properties do not affect the resonant frequency in the presence of a common-mode current distribution.

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用电场探针测量不同介质同轴电缆和连接器的屏蔽效能

确保适当的屏蔽对于电子设备和系统的电磁兼容性至关重要。本文用电场探头（EFP）研究了同轴电缆和连接器的屏蔽效能（SE）。这项研究的目的是早期识别屏蔽故障，以防止以后昂贵的修复。提出了一种在近场和远场条件下测量连接器和电缆辐射电场的方法。此外，建立了包含介电材料尺寸和性能的连接器和电缆的电磁虚拟模型。模拟的重点是不同介质对电场谐振频率，特别是共模能量的影响。结果表明，在共模电流分布下，介质特性对谐振频率没有影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程：电子与电气

CiteScore

6.00

自引率

22.60%

发文量

309

审稿时长

5.2 months

期刊介绍： Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.