{"title":"Tuning of magnetic properties and half-metallicity of electrodeposited Co-Fe-Sn Heusler alloy films by varying elemental composition","authors":"Pushpesh Pathak, Ananthakrishnan Srinivasan","doi":"10.1016/j.mtla.2025.102487","DOIUrl":null,"url":null,"abstract":"<div><div>In an attempt to invoke half-metallicity in non half-metallic Co<sub>2</sub>FeSn alloy by bandgap engineering, off-stoichiometric Co<sub>48.5</sub>Fe<sub>22.8</sub>Sn<sub>28.7</sub> (S1), Co<sub>51.7</sub>Fe<sub>21.6</sub>Sn<sub>26.7</sub> (S2), and Co<sub>53.8</sub>Fe<sub>20.6</sub>Sn<sub>25.6</sub> (S3) alloy films were electrodeposited on polycrystalline copper substrate. <em>L</em>2<sub>1</sub>-type ordered structure could be achieved in 1400 nm thick films after heat treatment at 550 °C for 1 hour. The processed films exhibited tunable soft ferromagnetic nature with high Curie temperature (∼1100 K) and high effective anisotropy constant (∼10<sup>6</sup> erg/cc). The magnetic moment of the films varied with composition. <em>Ab initio</em> calculations showed the finite density of states at the Fermi level (<em>E</em><sub>F</sub>) could not be completely suppressed in S1 and S2 alloys, while S3 exhibited a full bandgap in the minority band at <em>E</em><sub>F</sub>. Half-metallic nature of S3 was validated by temperature-dependent electrical resistivity data and Rhodes-Wohlfarth ratio estimated from thermomagnetization measurement. Apart from showcasing a method to induce half-metallicity in these ternary alloy films, this study has identified the Co<sub>53.8</sub>Fe<sub>20.6</sub>Sn<sub>25.6</sub> alloy film as a promising candidate for spintronic and high-temperature magnetic device applications.</div></div>","PeriodicalId":47623,"journal":{"name":"Materialia","volume":"42 ","pages":"Article 102487"},"PeriodicalIF":3.0000,"publicationDate":"2025-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materialia","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2589152925001553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
In an attempt to invoke half-metallicity in non half-metallic Co2FeSn alloy by bandgap engineering, off-stoichiometric Co48.5Fe22.8Sn28.7 (S1), Co51.7Fe21.6Sn26.7 (S2), and Co53.8Fe20.6Sn25.6 (S3) alloy films were electrodeposited on polycrystalline copper substrate. L21-type ordered structure could be achieved in 1400 nm thick films after heat treatment at 550 °C for 1 hour. The processed films exhibited tunable soft ferromagnetic nature with high Curie temperature (∼1100 K) and high effective anisotropy constant (∼106 erg/cc). The magnetic moment of the films varied with composition. Ab initio calculations showed the finite density of states at the Fermi level (EF) could not be completely suppressed in S1 and S2 alloys, while S3 exhibited a full bandgap in the minority band at EF. Half-metallic nature of S3 was validated by temperature-dependent electrical resistivity data and Rhodes-Wohlfarth ratio estimated from thermomagnetization measurement. Apart from showcasing a method to induce half-metallicity in these ternary alloy films, this study has identified the Co53.8Fe20.6Sn25.6 alloy film as a promising candidate for spintronic and high-temperature magnetic device applications.
期刊介绍:
Materialia is a multidisciplinary journal of materials science and engineering that publishes original peer-reviewed research articles. Articles in Materialia advance the understanding of the relationship between processing, structure, property, and function of materials.
Materialia publishes full-length research articles, review articles, and letters (short communications). In addition to receiving direct submissions, Materialia also accepts transfers from Acta Materialia, Inc. partner journals. Materialia offers authors the choice to publish on an open access model (with author fee), or on a subscription model (with no author fee).