Mold liners produced by incremental sheet forming

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.03.043

Putong Kang, Brett Wadman, Kornel Ehmann, Jian Cao (1)

引用次数: 0

Abstract

This study explores Incremental Sheet Forming (ISF) to fabricate mold liners as part of a newly proposed molding system for small-scale applications. A modified toolpath strategy, leveraging the tooltip geometry and feature skeleton, enabled the creation of high-quality features. The rotating forming tool introduced wavy surface textures, enhancing the functionality of the molded products. Polydimethylsiloxane (PDMS) molded with ISF-formed liners demonstrated good dimensional accuracy and smooth surface finishes. Compared to stereolithography (SLA)-printed liners, ISF-formed liners offered easier demolding and broader material compatibility. Future work will address high-pressure applications and more complex mold designs to expand industrial applicability.

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增量薄板成形生产的模具衬板

本研究探索增量板成形（ISF）制造模具衬垫作为新提出的成型系统的一部分，用于小规模应用。修改后的工具路径策略，利用工具提示几何和特性骨架，可以创建高质量的特性。旋转成型工具引入了波浪状的表面纹理，增强了成型产品的功能性。聚二甲基硅氧烷（PDMS）成型与isf形成的衬垫显示出良好的尺寸精度和光滑的表面处理。与立体光刻（SLA）打印衬垫相比，isf形成的衬垫更容易脱模，材料兼容性更广。未来的工作将解决高压应用和更复杂的模具设计，以扩大工业适用性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.