An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface With On-Chip Quantized Time-Domain Feature Extraction

IF 4.6 1区工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal of Solid-state Circuits Pub Date : 2025-04-10 DOI:10.1109/jssc.2025.3556441

You Jang Pyeon, Jeonghoon Cho, Geonjun Choi, Junyeong Yeom, Hyunjoong Kim, Sanghyeon Cho, Yonggi Kim, Taejung Kim, Jong-Hyun Kwak, Wootaek Cho, Woojae Jeong, Myeong Woo Kim, Yunsik Lee, Heungjoo Shin, Hoon Eui Jeong, Jae Joon Kim

引用次数: 0

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基于粘合剂贴片机的可重构多传感器贴片接口，具有片上量化时域特征提取功能

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Journal of Solid-state Circuits 工程技术-工程：电子与电气

CiteScore

11.00

自引率

20.40%

发文量

351

审稿时长

3-6 weeks

期刊介绍： The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.