Current Sharing and Mechanical Properties of Slot-n-Fill REBCO Tapes

IF 1.7 3区物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Applied Superconductivity Pub Date : 2025-03-04 DOI:10.1109/TASC.2025.3547318

Shengchen Xue;Lingfeng Zhu;Jian Rong;Nghia Mai;Yi Li;Siwei Chen;Umesh Sambangi;Jithin Peram;Venkat Selvamanickam

引用次数: 0

Abstract

Rare earth barium copper oxide (REBCO) coated conductor tapes and cables are promising material candidates for high- power-density and highly efficient electric machines and high magnetic field applications. Enhancing the current sharing in between different strands/layers is one of the practical methods to improve the overall quench stability of a multi-strand cable or a no-insulation coil. In this work, we introduce the slot-and-fill (Slot-n-Fill) method to increase current sharing in REBCO tapes. Compared to the original tape, the Slot-n-Fill tape has slightly different bending retention performance, ∼7% lower irreversible tensile strength, and ∼5% lower I_c. However, the current sharing metric (CSM) in a 2-ply stack is improved from 1.025 in the control sample to 1.2 in the Slot-n-Fill tape stack.

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n-填充型REBCO带的电流共享及力学性能

稀土钡氧化铜（REBCO）涂层导体带和电缆是高功率密度、高效率电机和高磁场应用的有前途的候选材料。提高不同股/层之间的电流共享是提高多股电缆或无绝缘线圈整体淬火稳定性的实用方法之一。在这项工作中，我们引入了插槽和填充（Slot-n-Fill）方法来增加REBCO磁带中的电流共享。与原始胶带相比，槽-n-填充胶带的弯曲保持性能略有不同，不可逆拉伸强度降低约7%，Ic降低约5%。然而，2层堆叠中的电流共享指标（CSM）从对照样品的1.025提高到槽-n-填充胶带堆栈的1.2。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Applied Superconductivity 工程技术-工程：电子与电气

CiteScore

3.50

自引率

33.30%

发文量

650

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Applied Superconductivity (TAS) contains articles on the applications of superconductivity and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Large scale applications include magnets for power applications such as motors and generators, for magnetic resonance, for accelerators, and cable applications such as power transmission.