Composite Engineering Facilitates High-Performance Cu2Se-GeTe Thermoelectrics.

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Qingyang Jian, Yaru Gong, Chen Chen, Rongxin Sun, Song Zhao, Tao Shen, Qingtang Zhang, Yang Geng, Yanan Li, Wei Dou, Congmin Liang, Yuqi Liu, Deshang Xiang, Pan Ying, Guodong Tang
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引用次数: 0

Abstract

Cu2Se has emerged as a promising thermoelectric material due to its low lattice thermal conductivity, high Seebeck coefficient, and high peak figure of merit (ZT) at elevated temperatures. However, its performance is limited by a high intrinsic carrier concentration and low carrier mobility. In this work, we investigate Cu2Se-based composites to overcome these challenges by introducing GeTe as compound phase to optimize carrier concentration, enhance mobility, and promote phonon scattering. The incorporation of GeTe significantly optimized both carrier concentration and mobility, with the Cu2Se/5 wt % GeTe composite exhibiting a carrier mobility of 30.8 cm2·V-1·s-1, more than twice that of pristine Cu2Se (11.4 cm2·V-1·s-1). Additionally, the inclusion of GeTe substantially reduced both the electrical and lattice thermal conductivity across the entire temperature range. These improvements culminated in a peak ZT of 2.2 at 923 K for the Cu2Se/10 wt % GeTe composite. These findings underscore the effectiveness of utilizing high-performance thermoelectric materials, such as GeTe, as secondary phases to substantially boost the thermoelectric properties of Cu2Se. This approach offers a promising pathway for the development of advanced thermoelectric materials for energy conversion applications.

Abstract Image

复合工程促进了高性能 Cu2Se-GeTe 热电技术的发展。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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