Effect of AA1060 thin layer and cooling rate on the structure and properties of rolled AA5083/TA1/Q235 composite plates

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-02-24 DOI:10.1016/j.matlet.2025.138287

Yufei Zhu , Bin Xu

{"title":"Effect of AA1060 thin layer and cooling rate on the structure and properties of rolled AA5083/TA1/Q235 composite plates","authors":"Yufei Zhu , Bin Xu","doi":"10.1016/j.matlet.2025.138287","DOIUrl":null,"url":null,"abstract":"<div><div>This study proposes a high-bonding strength Al/Ti/steel composite plate prepared by differential temperature rolling through heat transfer between different plates using the IHR(induction heating and rolling) method, and analyzed the addition of a thin layer AA1060 between TA1 and AA5083 and the impact of different cooling rates on the interface bonding strength. The results showed that increasing the cooling rate could effectively improve the interface bonding strength. Under oil cooling, the shear strength of Al/Ti and Ti/steel interfaces was 102 and 186 MPa, respectively. The results of EBSD showed that increasing the cooling rate could delay the growth of Al matrix grains, improve the shear strength of the Al/Ti interfaceand reduced the internal stress in the matrix near the Ti/steel interface, and improved the bonding strength of the Ti/steel interface. In addition, the presence of the thin layer of AA1060 effectively not only reduces the temperature difference between the TA1 and Q235 plates but also increases the temperature of the Ti/steel interface, thereby weakening the stress concentration at the Ti/steel interface after rolling, then, resulting in higher bonding strength.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"387 ","pages":"Article 138287"},"PeriodicalIF":2.7000,"publicationDate":"2025-02-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X25003167","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

This study proposes a high-bonding strength Al/Ti/steel composite plate prepared by differential temperature rolling through heat transfer between different plates using the IHR(induction heating and rolling) method, and analyzed the addition of a thin layer AA1060 between TA1 and AA5083 and the impact of different cooling rates on the interface bonding strength. The results showed that increasing the cooling rate could effectively improve the interface bonding strength. Under oil cooling, the shear strength of Al/Ti and Ti/steel interfaces was 102 and 186 MPa, respectively. The results of EBSD showed that increasing the cooling rate could delay the growth of Al matrix grains, improve the shear strength of the Al/Ti interfaceand reduced the internal stress in the matrix near the Ti/steel interface, and improved the bonding strength of the Ti/steel interface. In addition, the presence of the thin layer of AA1060 effectively not only reduces the temperature difference between the TA1 and Q235 plates but also increases the temperature of the Ti/steel interface, thereby weakening the stress concentration at the Ti/steel interface after rolling, then, resulting in higher bonding strength.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive