Optimization of a cylindrical heatsink with L-shaped fins to minimize thermal resistance variation by installation angle

IF 6.4 2区工程技术 Q1 THERMODYNAMICS

Case Studies in Thermal Engineering Pub Date : 2025-02-20 DOI:10.1016/j.csite.2025.105860

Gihyun Song, Hak-Ho Nam, Seungmin Heo, Se-Jin Yook

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引用次数: 0

Abstract

Light Emitting Diode (LED) lighting can be installed at various angles depending on user preferences. However, the cooling performance of heatsinks may decrease with changes in installation angle, potentially affecting the lifespan of LED lighting. This study considered L-shaped fins on a cylindrical base in an effort to minimize variations in thermal resistance with changes in installation angle while reducing the heatsink mass. Thermal resistance was analyzed based on the area removed from rectangular fins to form L-shaped fins. The heatsink's thermal resistance was predicted across a range of installation angles through numerical analysis using ANSYS FLUENT, and the accuracy of these predictions was validated experimentally. By varying the fin deletion area, fin count, and cylindrical base radius, the ranges of porosity factor and finning factor were determined as 0.7054 ≤ φ ≤ 0.7494 and 2.1069 ≤ ψ ≤ 3.9874, respectively. With the heatsink installation angle varying from 0° to 180°, the rate of change in thermal resistance for a cylindrical heatsink with rectangular fins (without a deletion area) was large, reaching 24 %, while that for a cylindrical heatsink with L-shaped fins was significantly reduced, staying within 10 %. A correlation equation to estimate the thermal resistance of an L-finned cylindrical heatsink was proposed, predicting thermal resistance with an error margin of up to 15 %. The cylindrical heatsink with L-shaped fins developed in this study is expected to be applicable in various LED lighting systems requiring both reduced heatsink mass and minimal thermal resistance variation with changes in installation angle.

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来源期刊

Case Studies in Thermal Engineering Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

8.60

自引率

11.80%

发文量

812

审稿时长

76 days

期刊介绍： Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.