Low temperature plasticity maximum in a Zr-Cu-Ni-Al bulk metallic glass

IF 5.8 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
A. Fadhil , Q.P. Cao , X.D. Wang , D.X. Zhang , J.Z. Jiang
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引用次数: 0

Abstract

The structural and mechanical properties of Zr60Cu20Ni10Al10 bulk metallic glass (BMG) were investigated using thermal and mechanical tests conducted over a wide temperature range from 5 K to 536 K. We reveal that the Zr-Cu-Ni-Al BMG exhibits significantly improved flexural strength and plasticity when bent at 77 K, in contrast to its behavior at room temperature. This behavior differs from other BMG systems, such as Zr-Cu-Ag-Al, Ti-Zr-Ni-Be-Cu, and La-Al-Ni-Cu-Co, which typically become more brittle as the temperature decreases. At 77 K, the high bending plasticity is attributed to the formation of numerous shear bands with lower average spacing, which play a vital role in accommodating plastic deformation. The fracture surface analysis reveals wide shear offsets and distinct steady-state growth regions, indicating enhanced plasticity at this temperature. Further investigations into the fundamental mechanisms indicate that the temperature-dependent plasticity difference between Zr-Cu-Ni-Al and Zr-Cu-Ag-Al BMGs is mainly associated with atomic arrangement efficiency and free volume dynamics, while the influence of phase separation on high plasticity is relatively minor. These findings highlight the significant role of atomic packing efficiency and free volume in promoting the formation of multiple shear bands and ultimately improving the mechanical performance of BMGs.
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来源期刊
Journal of Alloys and Compounds
Journal of Alloys and Compounds 工程技术-材料科学:综合
CiteScore
11.10
自引率
14.50%
发文量
5146
审稿时长
67 days
期刊介绍: The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.
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