Investigation of wettability and antimicrobial activity of Ti-Cu and Ti-Ag thin film metallic glasses coated on the surface of 316L, CoCrW, Ti6Al4V alloy substrates produced by selective laser melting

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS
Çetin Çimen , Mehmet Karakan , Didem Özgür , Ezgi Pelin Yıldız
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引用次数: 0

Abstract

This study includes examining the production of 316 L, CoCrW and Ti6Al4 V base materials using the selective laser melting method and investigating the properties of Ti-Cu and Ti-Ag thin film metallic glasses (TFMG) coated on the surfaces of these samples. Ti-Cu and Ti-Ag coatings were prepared by co-sputtering Ti-Cu and Ti-Ag targets in Argon gas plasma. Characterization of TFMG is focused on examining surface microstructure and physicochemical properties. Optical profilometry, X-ray Diffraction, Scanning Electron Microscopy, Energy Dispersive X-ray Spectroscopy and Atomic Force Microscopy analyzes were performed to determine structural features. Wettability and antimicrobial activity were also evaluated. The results demonstrated that Ti-Cu coatings, with a water contact angle ranging from 27.6° to 30.31°, and Ti-Ag coatings, with a contact angle between 7.62° and 9.68°, exhibit hydrophilic surfaces. Furthermore, they show high antimicrobial activity against various bacterial species, consistent with previous studies. However, variations in effect were observed among yeast strains, with Candida non-albicans species showing greater resistance due to their biofilm formation and resistance to metal ions. In contrast, Ti-Cu and Ti-Ag coatings displayed strong antifungal activity against Candida albicans, indicating potential suitability for clinical applications such as catheters and surgical implants. Despite their high antimicrobial efficacy, the limited effects on certain microorganisms underscore the need for more comprehensive evaluations under various conditions and long-term in vivo studies.
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来源期刊
Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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