An Intelligent Learning Reconfiguration Model Based on Optimized Transformer and Multi-Source Features (TMSF) for High-Precision InSAR DEM Void Filling

{"title":"An Intelligent Learning Reconfiguration Model Based on Optimized Transformer and Multi-Source Features (TMSF) for High-Precision InSAR DEM Void Filling","authors":"Tengfei Zhang, Yumin Chen, Rui Zhu, John P. Wilson, Jun Song, Ruoxuan Chen, Licheng Liu, Lanhua Bao","doi":"10.1109/tgrs.2025.3535546","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13213,"journal":{"name":"IEEE Transactions on Geoscience and Remote Sensing","volume":"24 1","pages":""},"PeriodicalIF":7.5000,"publicationDate":"2025-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Geoscience and Remote Sensing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/tgrs.2025.3535546","RegionNum":1,"RegionCategory":"地球科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}